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Headset

A technology for earphones and earphones, which is applied in earpiece/earphone accessories, on-ear/around-ear earphones, sensors, etc. It can solve the problems of complex structure of telescopic brackets and inability to improve assembly production efficiency, so as to improve assembly The effect of production efficiency and simple structure

Pending Publication Date: 2020-09-22
美律电子(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides a headphone, which solves the problem that the structure of the telescopic bracket of the current headphone is complicated and the production efficiency of assembly cannot be improved.

Method used

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0016] see figure 1 , figure 2 and image 3 , which are a perspective view, an exploded view, and a perspective view of a fastener in the first embodiment of the present invention; as shown in the figure, the headset 1 of this embodiment includes a headphone bracket 10, two buckle structures 11 and Two earphone connection brackets 12 and two buckle structures 11 are respectively arranged at two ends of the head-mounted bracket 10 . Each buckle stru...

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Abstract

A headset disclosed by the present invention comprises a headset support, a buckle structure and a headset connecting support; the buckle structure is arranged at one end of the headset support, and the buckle structure comprises a buckle part, wherein the inner surface of the buckle part is equipped with a first clamping part. The headset connecting support is arranged on the fastener in a penetrating mode, the earphone connecting support can move relative to the buckle structure, the surface, facing the inner surface of the fastener, of the earphone connecting support is provided with a plurality of second clamping parts, and the second clamping parts are arranged in the moving direction of the earphone connecting support. When the earphone connecting support moves relative to the bucklestructure, the length of the earphone connecting support extending out of the buckle structure is adjusted to a preset length, and the first clamping part is in interference connection with one of the second clamping parts. The headphone is simple in structure, and the assembly production efficiency is effectively improved.

Description

technical field [0001] The invention relates to the technical field of earphones, in particular to an earphone. Background technique [0002] There are currently two types of earphones, one is earphones and the other is headphones. The headset has a telescopic bracket through which the positions of the two earphones of the headset relative to the user's ears can be adjusted to suit the needs of different users. However, the existing telescopic support for headphones has the disadvantages of complex structure, many structural accessories, and complicated installation, which is not conducive to assembly and cannot meet the needs of production. In addition, the existing telescopic brackets use shrapnels as engaging parts, and the shrapnels are prone to deformation under long-term use, making the telescopic brackets unable to work normally. Contents of the invention [0003] An embodiment of the present invention provides a headphone, which solves the problem that the struct...

Claims

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Application Information

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IPC IPC(8): H04R1/10
CPCH04R1/1008H04R1/105
Inventor 张家伟吴星佑张杰
Owner 美律电子(惠州)有限公司
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