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High-temperature-resistant BOPP functional film for electronic equipment and preparation method of same

A technology for electronic equipment and high temperature resistance, applied in the field of high temperature resistant BOPP functional film for electronic equipment and its preparation, can solve the problem of high use cost, achieve the effects of reduced use cost, excellent electrical performance, and improved process parameters

Inactive Publication Date: 2020-09-25
ANHUI GUOFENG PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because circuit boards are often operated in high temperature environments during the production and welding of electronic components, BOPET films are generally used for packaging, transportation and storage, and such packaging films are for one-time use. The use cost is high, so it is necessary to provide a new type of film with high quality, low price and high temperature resistance

Method used

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  • High-temperature-resistant BOPP functional film for electronic equipment and preparation method of same

Examples

Experimental program
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Effect test

Embodiment 1

[0031] A high-temperature-resistant BOPP functional film for electronic equipment, which is sequentially composed of an anti-adhesive layer, a core layer, a sub-core layer and a printing layer. The raw materials of the anti-adhesive layer include by weight: 2 parts of anti-sticking agent, 10 parts of modified Polypropylene resin, 88 parts homopolypropylene;

[0032] The raw materials of the core layer include by weight: 1 part of antistatic agent, 40 parts of modified polypropylene resin, 59 parts of homopolypropylene;

[0033] The raw materials of the sub-core layer include by weight: 1 part of antistatic agent, 40 parts of modified polypropylene resin, 59 parts of homopolypropylene;

[0034] The raw materials of the printing layer include by weight: 2 parts of anti-sticking agent, 98 parts of homopolypropylene;

[0035] The thickness of the anti-sticking layer is 2 μm, the thickness of the printing layer is 1 μm, and the sum of the thickness of the core layer and the sub-co...

Embodiment 2

[0044] A high-temperature-resistant BOPP functional film for electronic equipment, which is sequentially composed of an anti-adhesive layer, a core layer, a sub-core layer and a printing layer. The raw materials of the anti-adhesive layer include by weight: 2 parts of anti-sticking agent, 15 parts of modified Polypropylene resin, 83 parts homopolypropylene;

[0045] The raw materials of the core layer include by weight: 1 part of antistatic agent, 45 parts of modified polypropylene resin, 54 parts of homopolypropylene;

[0046] The raw materials of the sub-core layer include by weight: 45 parts of modified polypropylene resin, 55 parts of homopolypropylene;

[0047] The raw materials of the printing layer include by weight: 2 parts of anti-sticking agent, 98 parts of homopolypropylene;

[0048] The thickness of the anti-sticking layer is 2 μm, the thickness of the printing layer is 1 μm, and the sum of the thickness of the core layer and the sub-core layer is 32 μm;

[0049]...

Embodiment 3

[0052] A high-temperature-resistant BOPP functional film for electronic equipment, which is sequentially composed of an anti-adhesive layer, a core layer, a sub-core layer and a printing layer. The raw materials of the anti-adhesive layer include by weight: 3 parts of anti-sticking agent, 15 parts of modified Polypropylene resin, 82 parts homopolypropylene;

[0053] The raw materials of the core layer include by weight: 1 part of antistatic agent, 45 parts of modified polypropylene resin, 54 parts of homopolypropylene;

[0054] The raw materials of the sub-core layer include by weight: 1 part of antistatic agent, 45 parts of modified polypropylene resin, 54 parts of homopolypropylene;

[0055] The raw materials of the printing layer include by weight: 3 parts of anti-sticking agent, 97 parts of homopolypropylene;

[0056]The thickness of the anti-sticking layer is 2 μm, the thickness of the printing layer is 1 μm, and the sum of the thickness of the core layer and the sub-cor...

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Abstract

The invention discloses a high-temperature-resistant BOPP functional film for electronic equipment, which is sequentially composed of an anti-sticking layer, a core layer, a secondary core layer and aprinting layer, wherein the anti-sticking layer comprises the following raw materials in parts by weight: 2-3 parts of an anti-sticking agent, 10-20 parts of modified polypropylene resin and 70-90 parts of homo-polypropylene; the core layer is prepared from the following raw materials in parts by weight: 0-2 parts of antistatic agent, 40-50 parts of modified polypropylene resin and 40-59 parts ofhomo-polypropylene; the secondary core layer comprises the following raw materials in parts by weight: 0-2 parts of an antistatic agent, 40-50 parts of modified polypropylene resin and 40-59 parts ofhomo-polypropylene; and the printing layer is prepared from the following raw materials in parts by weight: 2-3 parts of an anti-sticking agent and 97-98 parts of homo-polypropylene. The invention further discloses a preparation method of the high-temperature-resistant BOPP functional film for the electronic equipment. The size stability of the film is comparable with that of a BOPET film, but the use cost is greatly reduced, and the film is resistant to high temperature.

Description

technical field [0001] The invention relates to the technical field of biaxially stretched films, in particular to a high-temperature-resistant BOPP functional film for electronic equipment and a preparation method thereof. Background technique [0002] With the development of science and technology, more and more high-tech electronic products have entered people's lives. As a high-tech product, circuit board plays an important role in electronic products. Because circuit boards are often operated in high temperature environments during the production and welding of electronic components, BOPET films are generally used for packaging, transportation and storage, and such packaging films are for one-time use. The use cost is high, so it is necessary to provide a new film with high quality, low price and high temperature resistance. Contents of the invention [0003] Based on the technical problems in the background technology, the present invention proposes a high-temperat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B27/08B32B27/32B32B27/18B29C48/08B29C48/21B29C48/49B29C55/08C08L23/12C08L53/02C08K3/26C08K3/36C08J5/18
CPCB32B27/08B32B27/32B32B27/18B29C48/0018B29C48/08B29C48/21B29C48/49B29C55/08C08J5/18C08J2323/12C08J2423/12C08J2453/02C08K2003/265C08K3/36
Inventor 张涛王红兵张少伟
Owner ANHUI GUOFENG PLASTIC