Laminating device, flexible circuit board laminating machine and laminating method

Abstract

The present invention is applicable to the technical field of electronic machinery, and provides a laminating device, a flexible circuit board laminating machine and a laminating method, wherein the laminating device comprises: a frame, and a second place for providing a lamination layer is rotated and arranged Material roll; the first unwinding roll, which is rotated and set on the rack, is used to provide the main material, and a reference point for tracking is set on the main material; the electric eye tracking module is installed on the rack and refers to the main material Point position tracking; punching module, installed on the rack, used to punch the corresponding position of the tracking reference point of the electric eye tracking module on the bonding layer; driving component, used to drive the main material and the bonding layer transfer; among them, The transmission direction of the electric eye tracking module and the punching module is installed on the frame with the upper lamination component, which presses the overlapping lamination layers and the main material; the punching module, the upper lamination component, the driving component and the The electric eye tracking module is electrically connected to the controller. The advantages of the invention are as follows: the structure is simple, the lamination efficiency is high, the error is small, and the quality is high.

Description

technical field [0001] The invention belongs to the technical field of electronic machinery, and in particular relates to a bonding device, a flexible circuit board bonding machine and a bonding method. Background technique [0002] The flexible circuit board is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film. Good foldability. In recent years, great development has been achieved, especially in the fields of mobile phones, computers and LCD screens, CD players, disk drives, hard disk drives and wireless charging coil arrays. With the expansion of the market and application scope of flexible circuit boards, the demand for flexible circuit boards also increases, and the subsequent problem is how to complete the manufacture and processing of flexible circuit boards with high efficiency and low cost. In the process of processing the flexible circuit board, it is necessary to attach the flexible circuit board to the carrier boa...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide a laminating device, aiming to solve the problem of large lamination errors

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