Laminating device, flexible circuit board laminating machine and laminating method

A flexible circuit board and laminating device technology, which is applied in the orientation of circuit board tools, lamination of printed circuit boards, circuit lamination, etc., can solve problems such as large lamination errors

Active Publication Date: 2022-07-19
深圳市烯牛实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide a laminating device, aiming to solve the problem of large lamination errors

Method used

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  • Laminating device, flexible circuit board laminating machine and laminating method
  • Laminating device, flexible circuit board laminating machine and laminating method

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Embodiment Construction

[0031] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0032] The specific implementation of the present invention will be described in detail below with reference to specific embodiments. like figure 1 As shown, it is a structural diagram of a bonding device provided by an embodiment of the present invention, including:

[0033] The frame 1 is rotatably provided with a second unwinding roll 17 for providing the bonding layer 7;

[0034] The first unwinding roll 16, which is rotatably arranged on the frame 1, is used to provide the main material 2, and the main material 2 is set with a reference point for tracking;

[0035] The electric eye...

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Abstract

The present invention is applicable to the technical field of electronic machinery, and provides a laminating device, a flexible circuit board laminating machine and a laminating method, wherein the laminating device comprises: a frame, and a second place for providing a lamination layer is rotated and arranged Material roll; the first unwinding roll, which is rotated and set on the rack, is used to provide the main material, and a reference point for tracking is set on the main material; the electric eye tracking module is installed on the rack and refers to the main material Point position tracking; punching module, installed on the rack, used to punch the corresponding position of the tracking reference point of the electric eye tracking module on the bonding layer; driving component, used to drive the main material and the bonding layer transfer; among them, The transmission direction of the electric eye tracking module and the punching module is installed on the frame with the upper lamination component, which presses the overlapping lamination layers and the main material; the punching module, the upper lamination component, the driving component and the The electric eye tracking module is electrically connected to the controller. The advantages of the invention are as follows: the structure is simple, the lamination efficiency is high, the error is small, and the quality is high.

Description

technical field [0001] The invention belongs to the technical field of electronic machinery, and in particular relates to a bonding device, a flexible circuit board bonding machine and a bonding method. Background technique [0002] The flexible circuit board is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film. Good foldability. In recent years, great development has been achieved, especially in the fields of mobile phones, computers and LCD screens, CD players, disk drives, hard disk drives and wireless charging coil arrays. With the expansion of the market and application scope of flexible circuit boards, the demand for flexible circuit boards also increases, and the subsequent problem is how to complete the manufacture and processing of flexible circuit boards with high efficiency and low cost. In the process of processing the flexible circuit board, it is necessary to attach the flexible circuit board to the carrier boa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0008H05K3/0058H05K3/005H05K3/00H05K2203/06H05K2203/0221
Inventor 辛晓斌
Owner 深圳市烯牛实业有限公司
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