[0020] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0021] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.
[0022] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention based on specific situations.
[0023] The present invention will be described in detail below with reference to the accompanying drawings and examples.
[0024] Please refer to figure 1 , this embodiment provides a modular hard disk backplane, including the following structure:
[0025] The uplink device interface, subboard connector, external subboard, and hard disk connector are all connected to the subboard connector.
[0026] Uplink devices refer to the PCH or HBA cards and Expander cards on the motherboard. The uplink device interface is an interface through which the hard disk backplane is connected to the uplink device, which may be a cable connector or a board-to-board connector.
[0027] The hard disk connector is a connector for connecting hard disks, and is used to connect hard disks.
[0028] The external pinch includes multiple pinches with different driving forces. In this embodiment, two pinches are provided, namely, a capacitor pinch and a signal enhancement pinch. The pinch board connector is the interface connected with the external pinch board. It is mainly a high-density connector with a small shape and supports the signal rate of SAS3.0 to meet the high-speed transmission requirements.
[0029] Capacitor sub-board such as figure 2 As shown, it is mainly composed of input and output on-board high-speed wiring, high-speed coupling capacitors, and Mezz-Conn (high-density high-speed connector). The high-speed wiring of the capacitor subboard is described by taking the SAS/SATA TX signal of the upstream device as an example. The high-speed SAS/SATA signal from the upstream device is input from the Mezz-Conn, enters the input terminal of the capacitor, then outputs through the high-speed coupling capacitor, returns to the Mezz-Conn, outputs to the hard disk backplane, and then outputs to the hard disk connector. finally arrives on the hard drive. Signal enhancement sub-board such as image 3 As shown, it mainly includes Mezz-conn, SAS-Redriver module, power supply VCC module, and SAS-Redriver's Firmware storage module EEPROM. Among them, SAS-Redriver is a signal drive enhancement chip, VCC is to provide power to this chip, EEPROM is a Firmware that provides chip initialization and software configuration (EEPROM is a chip that stores Firmware for SAS-Redriver chip initialization and software configuration, and is a charged Erasable programmable read-only memory), Mezz-conn is a high-density signal connector docked with the hard disk backplane. The SAS/SATA TX signal of the upstream device is used as an example to illustrate the routing of the signal enhancement daughter board. The high-speed SAS/SATA signal received from the upstream device is input from Mezz-Conn, and the SAS/SATA signal enters the input end of the signal driver enhancement chip, and then outputs through the signal driver enhancement chip SAS-Redriver, and returns to Mezz-Conn, and then passes through the buckle The board connector outputs to the hard disk backplane, then outputs to the hard disk connector, and finally reaches the hard disk.
[0030] In the modular hard disk backplane provided in this embodiment, the external subboard adopts the capacitor subboard by default, that is, the subboard connector is connected to the capacitor subboard. When the uplink device is not included in the initial design evaluation device list, it is necessary to carry out targeted high-speed signal simulation, and then judge whether it is necessary to use the signal enhancement drive sub-board according to the evaluation results. If it is estimated that the driving capability of the uplink device is insufficient, remove the capacitor daughter board and connect the signal enhancement daughter board to the connector on the daughter board.
[0031] In the early stage of project design, high-speed signal simulation is carried out for the devices in the product upstream device list, and the length of the evaluated high-speed signal line of the hard disk backplane is simulated. Then simulate based on the high-speed signal after the two are matched, predict the driving force demand for the hard disk backplane, and judge whether to place the capacitor sub-board or the signal enhancement sub-board on the hard disk backplane.
[0032] Although the present invention has been described in detail in conjunction with preferred embodiments with reference to the accompanying drawings, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, those skilled in the art can make various equivalent modifications or replacements to the embodiments of the present invention, and these modifications or replacements should be within the scope of the present invention/any Those skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
