Water-cooling and air-cooling electronic power heat dissipation device

Abstract

The invention discloses a water-cooling and air-cooling electronic power heat dissipation device which comprises a heat dissipation plate, positioning heat dissipation fins, floating heat dissipationfins, a telescopic driving mechanism, an abutting cooling water plate, a lower connecting plate and an exhaust mechanism. In order to adapt to the space sizes of different cases, a floating telescopicstructure is designed, the water-cooling and air-cooling electronic power heat dissipation device telescopes and slides at the lower ends of the positioning cooling fins via the floating heat dissipation fins, and the lower connecting plate floats and stretches out and draws back below the heat dissipation plate, so that the whole structure can adapt to the cases with different thicknesses afterstretching out and drawing back.

Description

technical field [0001] The invention relates to a water-cooled air-cooled electronic power radiator. Background technique [0002] At present, the operation of electronic equipment will generate heat, which will cause the temperature of the entire equipment to rise, and the excessive temperature will greatly affect the stable operation of electronic equipment, and even burn out in severe cases, which requires cooling and heat dissipation devices. To cool down, the existing cooling and heat dissipation devices generally include a heat dissipation plate, heat dissipation fins, and an exhaust fan. The entire cooling and heat dissipation device is installed in the chassis, and one side of the heat dissipation plate is abutted against the back of the electronic device, and the other side of the heat dissipation plate is mounted on the back of the electronic device. Evenly distributed heat dissipation fins are installed on the side for heat dissipation, and the exhaust fan is used...

AI Technical Summary

Problems solved by technology

[0002] At present, the operation of electronic equipment will generate heat, which will cause the temperature of the entire equipment to rise, and the excessive temperature will greatly affect the stable operation of electronic equipment, and even burn out in severe cases, which requires cooling and heat dissipation devices. To cool down, the existing cooling and heat dissipation devices generally include a heat dissipation plate, heat dissipation fins, and an exhaust fan. The entire cooling and heat dissipation device is installed in the chassis, and one side of the heat dissipation plate is abutted against the back of the electronic device, and the other side of the heat dissipation plate is mounted on the back of the electronic device. Evenly distributed heat dissipation fins are installed on the side for heat dissipation, and the exhaust fan is used to increase the discharge of hot air flow and improve the heat dissipation effect. Sometimes electronic equipment is directly inserted into the heat dissipation fins for heat dissipation, but the existing heat dissipation method is relatively simple. The heat dissipation efficiency of the sheet exhaust method is average. In addition, different electronic chassis need to install heat dissipation devices of different thicknesses, especially ultra-thin chassis, which requires adaptive production, which greatly restricts the use of heat dissipation devices.

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