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Manufacturing execution system, electronic equipment assembling method and computer readable medium

A technology for manufacturing execution systems and electronic equipment, which is applied in the electronic field and can solve problems such as poor quality of electronic equipment

Active Publication Date: 2020-10-13
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the technical problem of poor quality of electronic equipment assembled in the traditional technology, this application provides a manufacturing execution system, an electronic equipment assembly method, and a computer program

Method used

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  • Manufacturing execution system, electronic equipment assembling method and computer readable medium
  • Manufacturing execution system, electronic equipment assembling method and computer readable medium
  • Manufacturing execution system, electronic equipment assembling method and computer readable medium

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0032] Reference herein to "an embodiment" or "implementation" means that a particular feature, structure or characteristic described in connection with the embodiment or implementation may be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood ...

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PUM

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Abstract

The application of the invention provides a manufacturing execution system, an electronic equipment assembling method and a computer readable medium. The manufacturing execution system comprises a first receiving module and a first signal generation module; the first receiving module is used for receiving marking code information of a to-be-assembled part; the first signal generation module is used for generating a first control signal according to the marking code information; and the first control signal is used for controlling compaction equipment to compact the to-be-assembled part on a bearing part. Compared with a traditional technique, the manufacturing execution system disclosed by the application has the advantages that when the first receiving module receives the marking code information scanned by a scanning device, the first control signal is generated, so that the compaction equipment is controlled to compact the to-be-assembled part on the bearing part; the risk of compacting missing of the to-be-assembled part is avoided; and the yield of electronic equipment is improved.

Description

technical field [0001] The present application relates to the field of electronic technology, and in particular to a manufacturing execution system, an electronic device assembly method, and a computer-readable medium. Background technique [0002] Electronic devices such as cell phones often include batteries waiting to be installed. The battery is used to supply power to other devices inside the electronic device (for example, a display screen, etc.). When electronic equipment is assembled, it is often necessary to install and fix the battery to the front case assembly. When the battery is fixed to the front case assembly by using adhesive, the battery needs to be pressed so that the battery is firmly bonded to the front case assembly. However, there is a risk of battery leakage and bonding in the traditional assembly method of electronic equipment, which leads to a low yield rate of the assembled electronic equipment. Contents of the invention [0003] In order to so...

Claims

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Application Information

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IPC IPC(8): F16B11/00
CPCF16B11/00
Inventor 单鹏
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD