Laser inscription device for chip processing

Abstract

The invention discloses a laser inscription device for chip processing. The laser inscription device comprises a bottom frame, a translation table, a fixing table and an adjusting rack, wherein the translation table is slidably mounted inside above the bottom frame, the fixing table is mounted in the center of the top of the translation table, the adjusting rack is mounted at the top of the bottomframe, bearing seats are mounted above and below the two sides of the adjusting rack correspondingly, a first threaded rod is rotationally mounted between the bearing seats on the same side, the first threaded rods on the two sides and the two ends of an electric sliding rail are movably mounted, and a sliding seat is mounted on the outer side of the electric sliding rail. According to the laserinscription device for chip processing, a chip is placed on a rubber pad of the fixing table, at the moment, an air pump works, the air pump is connected with a connecting hole and suction holes through an air faucet, suction force is generated at suction hole openings to suck and fix the chip, damage to the surface of the chip is avoided, the rubber pad plays a role in buffering, and impurities are prevented from being sucked into the interior of the air pump through a detachable filter screen.

Description

technical field [0001] The invention relates to the field of chip processing equipment, in particular to a laser marking device for chip processing. Background technique [0002] After the chip is processed, it uses a laser marking device to engrave the model and serial number on its outer surface, which is used to distinguish chip products. [0003] In the process of using the existing laser engraving device for chip processing, the movement of the laser engraving head is used to engrave the chip, and it is impossible to complete the inscription through the cooperation of the laser engraving head and the chip during the engraving process, which has certain limitations. ; At the same time, in the process of engraving, the chip needs to be fixed, and the existing clamping and fixing method will cause damage to the outside of the chip. Contents of the invention [0004] The object of the present invention is to provide a kind of laser marking device for chip processing, in ...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of laser marking device for chip processing, in order to overcome above-mentioned existing laser marking device for chip processing in the process of using, carry out lettering operation to chip by the movement of laser lettering head, can't be in the process of lettering In this method, the lettering is completed through the coordinated movement of the laser lettering head and the chip, which has certain limitations; at the same time, the chip needs to be fixed during the lettering process, and the existing clamping and fixing methods will cause technical problems on the outside of the chip.

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