Defect detection method, device, equipment and computer storage medium
A defect detection and defect technology, which is applied in the directions of measuring devices, optical testing flaws/defects, scattering characteristics measurement, etc., can solve problems such as the inability to detect the size of the objective lens
Active Publication Date: 2020-12-08
GOERTEK OPTICAL TECH CO LTD
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[0003] The invention provides a defect detection method, device, equipment and computer storage medium, aiming to solve the technical problem that the size defects below the diffraction limit of the objective lens cannot be detected at present
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[0043] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0044] The defect detection device mainly involved in the embodiments of the present invention refers to a network connection device capable of realizing network connection, and the defect detection device may be a server, a cloud platform, or the like.
[0045] refer to figure 1 , figure 1 It is a schematic diagram of the hardware structure of the defect detection equipment involved in various embodiments of the present invention. In the embodiment of the present invention, the defect detection device may include a processor 1001 (such as a central processing unit, CPU), a communication bus 1002 , an input interface 1003 , an output interface 1004 , and a memory 1005 . Wherein, the communication bus 1002 is used to realize the connection and communication between these components; the input interface 1003 is used f...
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Abstract
The invention discloses a defect detection method, device, equipment and computer storage medium. The method comprises: constructing a target wafer whose defect size has been calibrated; collecting a defect image corresponding to the target wafer, and obtaining the defect image corresponding to the target wafer The gray value of the target wafer; determine the defect size marked by the target wafer, so as to obtain the defect size mapping function according to the gray value of the defect image corresponding to the target wafer and the defect size marked by the target wafer; based on the defect size The mapping function is used to obtain the defect size corresponding to the wafer to be tested. Thus, the defect size mapping function is obtained by using the gray value of the defect image corresponding to the target wafer and the calibrated defect size of the target wafer, and then using the defect size mapping function and the gray value of the defect image in the wafer to realize any Detection of dimensional defects.
Description
technical field [0001] The present invention relates to the technical field of defect detection, in particular to a defect detection method, device, equipment and computer storage medium. Background technique [0002] At present, the method of wafer surface defect detection usually includes the surface defect detection method based on the principle of dark field scattering and the surface defect detection method based on the principle of bright field imaging. However, due to the limitation of the diffraction limit of the objective lens, these two methods cannot detect the objective lens. Tiny defects with dimensions below the diffraction limit. Contents of the invention [0003] The invention provides a defect detection method, device, equipment and computer storage medium, aiming at solving the technical problem that the size defects below the diffraction limit of the objective lens cannot be detected at present. [0004] In order to achieve the above object, the present...
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IPC IPC(8): G01N21/88G01N21/47
CPCG01N21/47G01N21/8851G01N2021/4735G01N2021/8874G01N2021/888G01N2021/8887
Inventor 艾立夫赵东峰董立超刘宝山刘艺朱春霖彭旭
Owner GOERTEK OPTICAL TECH CO LTD