Flow guide structure, heat dissipation structure and electronic device
A technology of a deflector and a cooling device, which is used in electrical components, structural parts of electrical equipment, cooling/ventilation/heating transformation, etc., can solve the problems of small space, inability to meet the HDD outlet temperature, and limited role of heat dissipation structure.
Pending Publication Date: 2020-10-23
HONG FU JIN PRECISION IND WUHAN CO LTD +1
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Problems solved by technology
The CPU (central processing unit) is powerful, and the new generation of CPU needs to support 65W. The hot air blown from the CPU HS (CPU heat sink) will flow back to the HDD (that is, the hard disk drive) to affect the temperature of the HDD, and the heat generated in the computer The heat emitted by the source will be dissipated to the CPU and CPU VR (core power supply chip); at the same time, the BTX space is getting smaller and smaller, and there is no extra space to install more heat dissipation modules; the current commonly used heat dissipation structure has limited effect
Therefore, the current traditional heat dissipation solution can no longer meet the user's requirement for the HDD outlet temperature to be 50°C
Method used
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[0027] In order to better understand the above objects, features and advantages of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, a lot of specific details are set forth to facilitate a full understanding of the present invention, and the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly...
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The present invention provides a flow guide structure. The flow guide structure comprises an inlet and a flow guide plate; channels which are communicated with the inlet and of which the extending directions are at least three different directions are formed in the flow guide plate; the channels in different directions are used for guiding airflow entering from the inlet to different positions, the flow guide structure is of an asymmetric structure, one side of the flow guide structure is a plane, and a preset angle is formed between the other side of the flow guide structure and one side of the plane. The invention further provides a heat dissipation structure comprising the flow guide structure and an electronic device.
Description
technical field [0001] The invention relates to a cooling system, in particular to a flow guiding structure, a cooling structure and an electronic device. Background technique [0002] The design of the BTX (mainboard architecture) structure is often used on computer platforms that require many external interfaces. The tail of the BTX needs to be equipped with many cards and interfaces. It is impossible to install a cooling module or set holes for heat dissipation. In the computer, only the PSU (that is, the power supply unit) With air outlet. The CPU (central processing unit) is powerful, and the new generation of CPU needs to support 65W. The hot air blown from the CPU HS (CPU heat sink) will flow back to the HDD (that is, the hard disk drive) to affect the temperature of the HDD, and the heat generated in the computer The heat emitted by the source will be dissipated to the CPU and CPU VR (core power supply chip); at the same time, the BTX space is getting smaller and sm...
Claims
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IPC IPC(8): H05K7/20
CPCH05K7/20145
Inventor 胡从旭姚志江
Owner HONG FU JIN PRECISION IND WUHAN CO LTD