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A rolling glue coating device for the production of electronic components

A technology for electronic components and gluing devices, which is applied to devices that apply liquid to surfaces, coatings, etc., can solve problems such as empty spots and excess spots, low product qualification rate, and uneven dispensing, and avoid faults. , The effect of uniform coating

Active Publication Date: 2021-12-10
中科同帜半导体(江苏)有限公司
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0002] With the development of electronic technology, electronic components are gradually developing towards miniaturization, light weight, high frequency, high current, low electromagnetic interference, low manufacturing cost, and high reliability. In order to meet the above requirements, more and more When processing electronic components, a layer of glue needs to be applied to the winding wire of the product. At present, the general practice is to use dispensing. Although this method can apply glue to the coil, it will cause dispensing failure. Uniformity, even empty spots and excessive spots, the product qualification rate is low, and debugging is difficult. In addition, ordinary dispensing methods cannot solve the problem of air bubbles in the glue

Method used

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  • A rolling glue coating device for the production of electronic components
  • A rolling glue coating device for the production of electronic components
  • A rolling glue coating device for the production of electronic components

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Embodiment Construction

[0016] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0017] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "another end" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific Azimuth configuration and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be understoo...

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Abstract

The invention discloses a rolling gluing device for the production of electronic components, comprising a base, support legs are symmetrically fixedly connected to the left and right sides of the bottom of the base, a bearing plate is arranged at the bottom between the two support legs, and the top of the bearing plate is A hydraulic push rod is fixedly installed in the middle of the base, and a lifting groove is opened in the middle of the top of the base. A chute is provided, and a loading platform is arranged on the top of the support shaft. The rolling gluing device for the production of electronic components according to the present invention sprays glue evenly on the top, middle and bottom of the electronic components during the rotation process of the electronic components, which solves the problem of uneven glue dispensing and even occurrence of For the problem of empty spots and excessive spots, scrape the three layers of glue evenly at the same time to make the glue evenly coated and avoid faults between the three layers of glue.

Description

technical field [0001] The invention relates to the field of production of electronic components, in particular to a rolling gluing device for the production of electronic components. Background technique [0002] With the development of electronic technology, electronic components are gradually developing towards miniaturization, light weight, high frequency, high current, low electromagnetic interference, low manufacturing cost, and high reliability. In order to meet the above requirements, more and more When processing electronic components, a layer of glue needs to be applied to the winding wire of the product. At present, the general practice is to use dispensing. Although this method can apply glue to the coil, it will cause dispensing failure. Uniformity, even empty spots and excessive spots, the product qualification rate is low, and debugging is difficult. In addition, ordinary dispensing methods cannot solve the problem of air bubbles in the glue. Contents of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C13/02B05C5/02B05C11/02
CPCB05C13/02B05C5/02B05C11/02
Inventor 韩是方韦
Owner 中科同帜半导体(江苏)有限公司
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