Dynamic scanning light source module and partition scanning dynamic lighting method
A light source module, dynamic scanning technology, applied in lasers, laser parts, semiconductor lasers, etc., can solve the problem of high power consumption of TOF modules
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0040] Such as Figure 1 to Figure 9 In the specific embodiment shown, the microlens array 21 includes a plurality of microlenses 211, two adjacent microlenses 211 are connected and smoothly transitioned, and the surfaces of all the microlenses 211 are connected to form a diffusion surface 212. Two adjacent microlenses 211 are connected and smoothly transitioned. The surfaces of all microlenses 211 are connected to form a diffusion surface 212. This arrangement makes the two adjacent microlenses 211 seamlessly connected to prevent the adjacent two The gap between the microlenses 211 causes light leakage, which affects the energy distribution of the spot on the detection surface, and further affects the imaging quality of the system.
[0041] It should be noted that the above-mentioned microlens array 21 is arranged periodically or randomly. The periodic arrangement is a regular and repetitive arrangement, and the structure design is simple, so that the boundary distribution of th...
Embodiment 2
[0067] The difference from the first embodiment is that the arrangement of the microlenses 211 is different. specific,
[0068] Such as Figure 10 to Figure 12 In the specific embodiment shown, the arrangement of the microlenses 211 is an arrangement in which the surface normal of the microlenses 211 diverges outward.
Embodiment 3
[0070] The difference from the first embodiment is that the partitioning mode of the microlens array is different.
[0071] Such as Figure 13 As shown, the microlens array is divided into multiple light-transmitting areas, and the position, shape and size of the multiple light-transmitting areas can be the same or different.
PUM
Property | Measurement | Unit |
---|---|---|
Length | aaaaa | aaaaa |
Length | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com