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Laying device

A technology of control devices and induction coils, applied in sustainable manufacturing/processing, electrical components, climate sustainability, etc., can solve problems such as chip wrinkles, large size errors, time-consuming and labor-intensive problems, and achieve the goal of avoiding wrinkles and improving work efficiency Effect

Pending Publication Date: 2020-10-30
汉瓦技术有限公司
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AI Technical Summary

Problems solved by technology

At present, there are two main methods for laying and laminating photovoltaic modules on curved surfaces: one is to manually lay solar chips on curved substrates, which is time-consuming and laborious, and the rebound of the chips will cause large size errors during lamination. The other is to lay the flexible solar chip on the curved substrate through the magnetic chuck tooling. This method improves the bonding rate of the solar chip, but because the magnetic force of the magnetic chuck cannot be adjusted, it will cause the chip to be wrinkled during the laying process. , it needs manual smoothing for the second time

Method used

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Embodiment Construction

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below in conjunction with the drawings of the embodiments of the present application. Apparently, the described embodiments are some of the embodiments of the present application, but not all of them. Based on the described embodiments of the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0025] Such as figure 1 As shown, where the direction of the arrow is the first direction, one embodiment of the present application provides a laying device, which is mainly used to lay the parts to be laid on the substrate, especially the substrate with a certain curvature, the laying device includes several The induct...

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Abstract

The invention belongs to the technical field of photovoltaic module processing, and discloses a laying device. The laying device is characterized by comprising a plurality of induction coils and a control device, wherein each induction coil is electrically connected with a power supply, and the induction coils are arranged according to the shape of a substrate; the substrate is placed on the induction coils; and the control device controls the fitting degree of a to-be-laid piece and the substrate by controlling the connection time of each induction coil and the power supply and the magnitudeof current input into the induction coils. By electrifying the induction coils in sequence, the to-be-laid piece can be gradually attached to the substrate, wrinkles of the to-be-laid piece are avoided, secondary manual smoothing is not needed, and the working efficiency of the device is improved.

Description

technical field [0001] This article relates to the technical field of photovoltaic module processing, in particular to a laying device. Background technique [0002] In the manufacturing process of photovoltaic modules, flexible solar chips need to be laid on the substrate before being pressed by the laminator. When the substrate is a curved surface with a certain radian, since the flexible solar chip itself has a certain degree of disturbance, it is difficult to fit the flexible solar chip to the curved surface during the laying process of the photovoltaic module. fit. At present, there are two main methods for laying and laminating photovoltaic modules on curved surfaces: one is to manually lay solar chips on curved substrates, which is time-consuming and laborious, and large dimensional errors will be caused by the springback of chips during lamination ; The other is to lay the flexible solar chip on the curved substrate through the magnetic chuck tooling. This method i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683H01L31/18
CPCH01L31/18H01L21/67H01L21/683Y02P70/50
Inventor 王尉朱文凯白云强蔺晓东
Owner 汉瓦技术有限公司
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