SOP packaging integrated circuit chip dismounting device

Abstract

The invention discloses a SOP packaging integrated circuit chip dismounting device, comprising a dismounting structure; wherein a baking structure is arranged in the dismounting structure, a movable groove is formed in the middle of the interior of the dismounting structure, a movable column is telescopically and movably connected in the movable groove, and a limiting structure is detachably connected to the bottom end of the dismounting structure, and the top ends of two side walls, away from each other, of dismounting structure are connected with filtering structures. According to the invention, heating is carried out through the electric heating tube detachably connected in the connecting groove; the high temperature is transmitted out along the ventilation groove through the air blownout by the fan, and the welding point of the chip is heated. After the welding points of the chip are melted, the disassembly structure is taken down from the circuit board through the handle; and then the fan and the heating structure are turned off, the movable column is pushed back into the movable groove, the gripper can be gradually loosened along the torsional spring, and therefore the detached chip is distached. The chip can be rapidly dismounted through the dismounting structure, and the dismounting structure is small in size and convenient to operate.

Description

Technical field: [0001] The invention belongs to the technical field of related structures of circuit chip disassembly equipment, and particularly relates to a disassembly device for SOP packaged integrated circuit chips. Background technique: [0002] The SOP packaged integrated circuit chip is an integrated chip mounted on the circuit board. With the development of technology, there are many types of similar chips, which can be seen on the circuit board. By installing such chips on the circuit board , which can effectively improve the performance of the circuit board, and the installation of different chips can also allow the circuit board to cope with different working environments and application fields. [0003] Nowadays, most of these chips are soldered on the circuit board, which makes the current chips more complicated to disassemble, requiring special professional equipment to be disassembled, and the size of these devices is generally relatively large, which leads ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is just to provide a kind of dismantling device of SOP packaging integrated circuit chip in order to solve the above-mentioned problem, through baking structure and auxiliary structure, can effectively solve above-mentioned present these chips are mostly welded on the circuit board, This makes disassembly of the current chip more cumbersome and requires special professional equipment to be disassembled, and these devices are generally relatively large in size, which leads to many discarding the entire circuit board due to damage to the chip. Directly increase the production cost of production, and the directly discarded circuit boards will also have a certain negative impact on the surrounding environment.

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