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Lamp filament support capable of being connected in parallel and LED packaging structure

A technology of filament support and parallel connection, which is applied in the direction of lighting devices, components of lighting devices, semiconductor devices of light-emitting elements, etc., which can solve the problem of LED packaging structure not being bright, high material and production costs, and inability to protect the filament carrier 220 and other issues, to meet the requirements of reducing material strength, reasonable connection structure, and reduce the effect of using voltage

Pending Publication Date: 2020-11-06
ZHONGSHAN MULINSEN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, such a structure makes the plurality of light-emitting chips 230 can only be connected in series. When one of the light-emitting chips 230 fails, the entire LED package structure will not be bright. At the same time, due to the metal bracket 210 Metal riveting is only performed on both ends of the filament carrier 220 in the length direction, which only serves to fix the filament carrier 220 and cannot protect the filament carrier 220. At the same time, the material of the filament carrier 220 Ceramic or sapphire materials are often used, resulting in high material and production costs

Method used

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  • Lamp filament support capable of being connected in parallel and LED packaging structure
  • Lamp filament support capable of being connected in parallel and LED packaging structure
  • Lamp filament support capable of being connected in parallel and LED packaging structure

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Embodiment Construction

[0022] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments. The following experimental examples and examples are used to further illustrate but not limit the present invention.

[0023] see image 3 , the present invention provides a filament holder 100 that can be used in parallel, and the filament holder 100 that can be used in parallel includes a first metal holder 110 and a second metal holder 120 that are oppositely arranged. The first metal bracket 110 and the second metal bracket 120 are jointly used to fix the filament carrier, and serve as positive pole and negative pole respectively in the LED package structure.

[0024] The first metal bracket 110 includes a first body portion 111 and a first extension portion 112 extending from the first body portion 111 toward the second metal bracket 120 .

[0025] The first body part 111 includes a first electrode part 1111 and a first locking part 1112 extendin...

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Abstract

The invention discloses a lamp filament support capable of being connected in parallel. The lamp filament support comprises a first metal support and a second metal support which are oppositely arranged. The first metal support comprises a first body part and a first extending part extending from the first body part to the second metal support. The second metal support comprises a second body partand a second extending part extending from the second body part to the first metal support, and the first extending part and the second extending part are oppositely arranged in a spaced mode. Compared with the prior art, the lamp filament support capable of being connected in parallel can achieve parallel connection of light-emitting chips, and is better in structural strength and lower in material cost. The invention further provides an LED packaging structure.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a filament support capable of parallel connection and an LED packaging structure. Background technique [0002] With the continuous improvement of LED (Light Emitting Diode) packaging technology, LED lamps have entered thousands of households, and the market demand is also increasing, while the price of lamps continues to drop. Therefore, it is necessary to continuously explore ways to improve product performance and reduce costs. The method, that is, high light efficiency has always been the goal pursued in the LED industry. [0003] Please refer to figure 1 and figure 2 , the prior art LED package structure 200 includes a metal support 210 with positive and negative poles, a filament carrier 220 fixed on the metal support 210 and a plurality of light-emitting chips 230 mounted on the filament carrier 220, the metal support 210 includes a first metal bracket 211 and a ...

Claims

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Application Information

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IPC IPC(8): F21K9/00F21V19/00F21V23/06H01L33/62F21Y115/10
CPCF21K9/00F21V19/002F21V19/0025F21V23/06F21Y2115/10H01L33/62
Inventor 皮保清王小强杨进谢春望张瑶聂伟苹石红丽闫玲
Owner ZHONGSHAN MULINSEN ELECTRONICS CO LTD
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