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Heat dissipation structure for computer terminal

A technology of heat dissipation structure and computer terminal, which is applied in the direction of electrical digital data processing, digital processing power distribution, instruments, etc., can solve the problems of difficulty in improving heat dissipation effect, inconvenient cleaning, maintenance and replacement, etc., and achieves novel structure and ingenious design. , Improve the effect of heat dissipation

Pending Publication Date: 2020-11-13
广东迅扬科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation fans are all fixed at preset positions in the computer case, which is inconvenient to clean, maintain and replace. In addition, the traditional heat dissipation only depends on the air outlet of the heat dissipation fan, and the heat dissipation thinking is fixed, so it is difficult to improve the heat dissipation effect.

Method used

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  • Heat dissipation structure for computer terminal
  • Heat dissipation structure for computer terminal
  • Heat dissipation structure for computer terminal

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Embodiment Construction

[0030] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention. The present invention will be described in detail below in conjunction with the accompanying drawings.

[0031] A heat dissipation structure for a computer terminal, such as Figure 1 to Figure 4 As shown, it includes a sliding bracket 1, a cooling bracket 2, and a fan body 3 installed in the middle of the cooling bracket 2. The cooling bracket 2 is provided with a plurality of air inlet slots 4, and a plurality of air inlet slots 4 are located in the fan body. 3, the cooling bracket 2 is detachably connected to the sliding bracket 1. Specifically, this embodiment has a novel structure and ingenious design. The sliding bracket 1 can be slidably installed in the computer case, so that the slid...

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PUM

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Abstract

The invention relates to the technical field of computer accessories and specifically a heat dissipation structure for a computer terminal. The heat dissipation structure comprises a sliding support,a heat dissipation support and a fan body arranged in the middle of the heat dissipation support, wherein a plurality of air inlet grooves are formed in the heat dissipation support and located in theperiphery of the fan body, and the heat dissipation support is detachably connected with the sliding support. The heat dissipation structure is novel in structure and ingenious in design; the slidingbracket can be arranged in a computer case in a sliding manner; the sliding bracket can be conveniently pulled out of the computer case at any time so as to replace, maintain, clean the fan; the heatdissipation structure is very convenient to use, the fan body is arranged in the middle of the heat dissipation support and further matched with the design of the air inlet groove; when the fan bodyworks, cold air can enter the computer case, and the heat dissipation effect in the computer case is improved to the maximum extent.

Description

technical field [0001] The invention relates to the technical field of computer accessories, in particular to a heat dissipation structure for a computer terminal. Background technique [0002] Computer (computer), commonly known as computer, is an electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and also has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. With the continuous development of microelectronics technology, the main chips of electronic and electrical products such as computers are required to run faster and faster, with higher power, smaller volume, and higher integration. The heat generated is also increasing. How to quickly dissipate the continuous heat generated by the semiconductor chip so that the chip can work normally at a timely temperature has become an importa...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/181G06F1/20
Inventor 张利新马建功王晓艳
Owner 广东迅扬科技股份有限公司
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