Epitaxial structure and manufacturing method thereof

An epitaxial structure and control structure technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problem that the opening position, distribution uniformity and opening size are not easy to control, affect the internal quantum efficiency of light-emitting elements, and reduce the internal quantum efficiency of light-emitting elements. and other problems, to achieve the effect of improving internal quantum efficiency, reducing dislocations, and increasing uniformity

Active Publication Date: 2022-04-26
XIAMEN SILAN ADVANCED COMPOUND SEMICON CO LTD
View PDF14 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, nitride semiconductor light-emitting elements generally use heteroepitaxy, and the lattice mismatch leads to a large number of dislocations in the light-emitting element, and the dislocation density is as high as 10 8 to 10 10 cm -2 , which reduces the growth quality of the epitaxial layer, thereby reducing the internal quantum efficiency of the light-emitting element
In addition, since V-shaped pits (V-pits) are easily generated during the epitaxial growth process, the opening position, distribution uniformity, and opening size of the V-shaped pits will all affect the internal quantum efficiency of the light-emitting element, and in the prior art , the opening position, distribution uniformity and opening size of the V-shaped depression are not easy to control

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epitaxial structure and manufacturing method thereof
  • Epitaxial structure and manufacturing method thereof
  • Epitaxial structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0075] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown. For simplicity, the epitaxial structure obtained after several steps can be described in one figure.

[0076] It should be understood that when describing the structure of a device, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also included between it and another layer or another region. And, if the device is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.

[0077] If it is to describe the situation directly on another layer or another area, the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The application discloses an epitaxial structure and its manufacturing method, which is located on the first carrier supply layer on the substrate; the control structure is located on the first carrier supply layer, including multiple quantum well layers; multiple V-shaped depressions , extending from the surface of the regulating structure into the regulating structure; and a second carrier supply layer located on the regulating structure, wherein at least two V-shaped depressions are different. The epitaxial structure of the present invention controls the extension depth of each V-shaped depression in the control structure through the regulating structure, which not only improves the uniformity of the distribution of the V-shaped depressions in the longitudinal direction of the epitaxial structure, disperses the stress, but also increases the mechanical strength of the epitaxial structure. The uniformity of intensity, thereby improving the internal quantum efficiency of the light-emitting element.

Description

technical field [0001] The present disclosure relates to the field of epitaxial structure manufacturing, and more particularly, to an epitaxial structure and a manufacturing method thereof. Background technique [0002] Compound semiconductor light-emitting elements have become the mainstream lighting source in the market because of their advantages such as energy saving and environmental protection, high luminous efficiency, easy control of color wavelength, small size, and long service life. They are widely used in home lighting, outdoor street lighting, stage lighting, transportation, etc. Various lighting and display fields such as signal lights, TV backlights, mobile phone computer backlights, indoor display screens, and car lights. [0003] In the prior art, nitride semiconductor light-emitting elements have relatively high luminous efficiency, and thus have been more and more widely used in the lighting field. [0004] However, nitride semiconductor light-emitting el...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/06H01L33/24H01L33/14H01L33/32
CPCH01L33/06H01L33/24H01L33/14H01L33/32
Inventor 范伟宏李东昇邬元杰蒋敏张成军
Owner XIAMEN SILAN ADVANCED COMPOUND SEMICON CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products