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Sealed spraying heat dissipation type computer case

A heat-dissipating and computer technology, applied in the field of sealed spray heat-dissipating computer cases, can solve problems such as hidden safety hazards, reduced component life, system operation obstacles, etc., achieve effective recycling of working fluid, improve use safety, and improve The effect of heat exchange efficiency

Pending Publication Date: 2020-11-17
北京一莱汀光电技术发展有限公司
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  • Abstract
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Problems solved by technology

In the process of heat dissipation in air-cooled mode, the fan rubs against the air and the dust in the air to generate static electricity and absorb dust particles. After a long time of operation, it will cause dirt accumulation and reduce the heat dissipation effect. In addition, it is easy to cause a short circuit in a humid environment, which is safe. Hidden danger: heat dissipation delay, the general fan-type fan heat is controlled by the temperature sensor to control the fan speed. When the temperature of the component increases, the information is provided to the sensor, and the sensor commands to change the fan speed. There is a certain loss of components, which reduces the life of components; in addition, after a long period of use, a large amount of dust will enter the interior of the computer case, which will hinder the operation of the system and is not easy to clean

Method used

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  • Sealed spraying heat dissipation type computer case
  • Sealed spraying heat dissipation type computer case
  • Sealed spraying heat dissipation type computer case

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Embodiment Construction

[0060] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.

[0061] The terminology used in the present invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein and in the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as use...

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Abstract

The invention relates to the technical field of computer heat dissipation, in particular to a sealed spraying heat dissipation type computer case which comprises a case body, wherein the case body comprises an upper case body, a lower case body and a liquid separation fixing plate, the upper case body and the lower case body are separated through the liquid separation fixing plate, the liquid separation fixing plate is provided with a liquid inlet and a liquid outlet, and a heating element is arranged in the upper case body; a circulating heat exchange system provided with an inlet and an outlet, wherein the inlet is connected with the liquid outlet, the outlet is connected with the liquid inlet, the circulating heat exchange system comprises a heat exchange device and a circulating pump;and a spraying system connected with the liquid inlet in a communicating mode, wherein the spraying system can enable the working medium cooled by the circulating heat exchange system to be sprayed toa heating element. And the liquid separation fixing plate comprises a sealed electric connector. The technical problem that an air cooling mode adopted in a traditional mode is poor in heat dissipation effect on a heating element is solved, and the technical effect of effectively recycling a working medium in a limited space is achieved.

Description

Technical field: [0001] The invention relates to the technical field of computer cooling, in particular to a sealed spray cooling computer case. Background technique: [0002] With the development of science and technology, the requirements for computer heat dissipation are getting higher and higher. In the process of heat dissipation in the air-cooled mode, the fan rubs against the air and the dust in the air to generate static electricity and absorb dust particles. After a long time of operation, dirt will accumulate and the heat dissipation effect will be reduced. In addition, it is easy to cause a short circuit in a humid environment, which is a safety hazard. Hidden danger: heat dissipation delay, the general fan heat is controlled by the temperature sensor to control the fan speed. When the temperature of the components increases, the information is provided to the sensor, and the sensor commands to change the fan speed. There is a certain amount of wear and tear on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 郭倩
Owner 北京一莱汀光电技术发展有限公司
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