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A speaker module and electronic equipment

A speaker module and sound unit technology, applied in the direction of sensors, electrical components, etc., can solve the problems of cumbersome assembly process, high mold cost, complex process, etc., and achieve the effect of reducing processing cost, improving yield rate, and simple manufacturing process

Active Publication Date: 2021-11-26
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the isolation component is made of the isolation net and the isolation frame by insert injection molding. When the isolation net is used as an insert and the isolation frame is injection molded, on the one hand, the process is relatively complicated, the mold cost is high, and the yield rate is low. On the other hand, the assembly process cumbersome and less efficient

Method used

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  • A speaker module and electronic equipment
  • A speaker module and electronic equipment
  • A speaker module and electronic equipment

Examples

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Embodiment Construction

[0029] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0030] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0031] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different values.

[0032] It should be noted that like numerals and letters denote like items in the following figures, therefore, once an item is defined in one figure, it does n...

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PUM

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Abstract

The invention discloses a loudspeaker module, which comprises a housing with a receiving cavity and a sounding unit accommodated in the receiving cavity, and the sounding unit divides the receiving cavity into a front cavity and a rear cavity; the casing includes a lower A shell and an upper shell, the upper shell includes a first body portion and a first partition wall protruding from the first body portion, the lower shell includes a second body portion and a partition wall protruding from the second body portion The second partition wall, the first partition wall and the second partition wall are butted and inserted, and the rear cavity is divided into a first rear cavity and a second rear cavity, and the second rear cavity is filled with sound-absorbing particles; An air-permeable isolation channel is formed between the end surfaces of the first isolation wall and the second isolation wall, and the width of the air-permeable isolation channel is smaller than the diameter of the sound-absorbing particles. The processing and assembly of isolation components in the traditional design are omitted, the manufacturing process is relatively simple, and the processing cost is reduced; the assembly process is reduced, the difficulty is reduced, and the assembly efficiency and yield rate are significantly improved.

Description

technical field [0001] The invention relates to the technical field of electroacoustic conversion, in particular to a loudspeaker module and electronic equipment. Background technique [0002] With social and economic development and consumption upgrades, consumers have put forward higher requirements for the sound quality of electronic equipment, which requires more space for the sound cavity design of speaker modules, but the contradiction is that consumers have higher requirements for some electronic equipment. The portability requirements of the equipment are getting higher and higher, and the expansion of the sound chamber space is limited, and even further compression of the space is required. [0003] In order to expand the volume of the sound cavity, reduce the low frequency of the module, and expand the bandwidth, sound-absorbing particles are generally filled in the rear cavity of the module. In order to prevent the sound-absorbing particles from entering the speak...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R9/02H04R9/06
CPCH04R9/025H04R9/06
Inventor 李兆鹏陈国强
Owner GOERTEK INC
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