Pressure cylinder, pressurizing device and hot-pressing sintering equipment

A pressurizing device and pressure cylinder technology, applied in fluid pressure actuating devices, mechanical equipment, fluid pressure converters, etc., can solve the problems of small pressure adjustment range, uniform volume, and inability to meet the pressurization requirements of semiconductor devices, and achieve The effect of meeting the pressurization demand and increasing the pressure adjustment range

Pending Publication Date: 2020-11-24
深圳市先进连接科技有限公司
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

However, the volume of the single-layer cylinder in the traditional structure is uniform, the adjustment range of the pressure that can be applied to the pressure head is small, and the height and specifications of the semiconductor devices are different. The traditional pressurization device cannot meet the semiconductor devices of different specifications and heights. pressurization needs

Method used

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  • Pressure cylinder, pressurizing device and hot-pressing sintering equipment
  • Pressure cylinder, pressurizing device and hot-pressing sintering equipment
  • Pressure cylinder, pressurizing device and hot-pressing sintering equipment

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] It should be noted that if there are directional indications such as up, down, left, right, front, back, etc. in the embodiment of the present invention, the directional indications are only used to explain the position of each individual in a certain posture as shown in the attached figure. If the relative positional relationship, movement conditions, etc. between the components change, the directional indication will also change accordingly. ...

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Abstract

The invention provides a pressure cylinder, a pressurizing device applying the pressure cylinder and hot-pressing sintering equipment applying the pressurizing device. The pressure cylinder comprisesa cylinder body and a plurality of piston rods, wherein a plurality of pressure cavities are formed in the cylinder body; every two adjacent pressure cavities communicate with each other through a first through hole; a second through hole communicating with one pressure cavity is further formed in the cylinder body; the second through holes and the first through holes are coaxially formed; a plurality of air inlet holes and a plurality of air outlet holes are formed in the cylinder body; one air inlet hole and one air outlet hole communicate with one pressure cavity; each piston rod is movablyarranged in one pressure cavity and penetrates through one first through hole to extend into another pressure cavity, so that the piston rods are sequentially propped against one another; and one piston rod penetrates through the second through hole to extend out of the cylinder body. According to the technical scheme, the pressure adjusting range of the hot-pressing sintering equipment is enlarged, and the pressurizing requirements of different types of semiconductor devices are met.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a pressure cylinder, a pressurization device using the pressure cylinder, and a hot-press sintering equipment using the pressurization device. Background technique [0002] In the hot pressing sintering equipment, the cylinder is often used as the driving part of the pressurization device to drive the press head to pressurize and package the semiconductor device. However, the volume of the single-layer cylinder in the traditional structure is uniform, the adjustment range of the pressure that can be applied to the pressure head is small, and the height and specifications of the semiconductor devices are different. The traditional pressurization device cannot meet the semiconductor devices of different specifications and heights. pressurization needs. Contents of the invention [0003] The main purpose of the present invention is to propose a pressure cylinder, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F15B15/14F15B15/20F15B3/00H01L21/67
CPCF15B3/00F15B15/1404F15B15/1409F15B15/1414F15B15/1423F15B15/1457F15B15/149F15B15/20H01L21/67098
Inventor 岑玮靳清吴昊胡博
Owner 深圳市先进连接科技有限公司
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