Adhesive dispensing machine for semiconductor apparatus
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A technology of dispensing machine and semiconductor, which is applied to the surface coating device, spray device, coating, etc., can solve the problems of easy dripping, affecting the use of semiconductor devices, increasing the number of defective semiconductor products, etc., to keep clean Neat, reducing the generation of defective products, reducing the effect of glue drawing
Active Publication Date: 2020-11-27
人民百业科技有限公司
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[0002] Due to the controllable conductivity of semiconductors, semiconductor devices are widely used in various fields such as integrated circuits and lighting. When processing semiconductor devices, different semiconductor materials are coated with glue on the surface of the material by a dispenser and bonded; In the prior art, when a glue dispenser is used to dispense glue to semiconductor devices, because part of the glue is in a relatively viscous fluid state, when the dispensing tube is in contact with the semiconductor material, a small amount of glue adheres to the outside of the dispensing tube, and the workload of dispensing increases. , and the glue on the outside of the dispensing tube increases. When the dispensing tube moves up and down, the glue will drip down by gravity to form a wire drawing phenomenon, and it will easily drop on the non-dispensing position of the semiconductor device, which will affect the use of semiconductor devices and increase semiconductor defective products.
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Embodiment 1
[0027] as attached figure 1 to attach Figure 5 Shown:
[0028] The invention provides a glue dispensing machine for semiconductor devices, the structure of which includes a body 1, a glue dispenser 2, a conveyor 3, and a control panel 4. The glue dispenser 2 is installed at the top center of the front of the body 1, and the conveyor 3 It is arranged on the top surface of the body 1 , and the control panel 4 is located on the front of the body 1 .
[0029] The dispenser 2 is provided with a glue accumulating chamber 21, a push plate 22, a slide bar 23, a dispensing tube 24, and an inner tube 25. The glue accumulating chamber 21 is located inside the dispenser 2, and the push plates 22 are installed On the inner wall of the middle part of the glue dispenser 2 , the dispensing tube 24 vertically moves up and down in the inner bottom of the glue dispenser 2 through the slide bar 23 , and the inner tube 25 is arranged inside the glue dispensing tube 24 .
[0030] Wherein, the i...
Embodiment 2
[0036] as attached Image 6 to attach Figure 8 Shown:
[0037]Wherein, the clamping block a6 is provided with a clamping groove a61, an elastic block a62, a connecting plate a63, and a clearing block a64. The clearing block a64 runs through the inner side of the clamping block a6, and the clearing block a64 is movably matched with the elastic block a62 through the connecting plate a63. The clearing block a64 is provided with five pieces and surrounds the outside of the telescopic tube a5, which is conducive to fully closing the telescopic tube a5. A small amount of glue left on the exterior is removed.
[0038] Wherein, the clearing block a64 is composed of a brush plate d1, a groove d2, and a glue accumulation block d3, the brush plate d1 is fixed on the top of the glue accumulation block d3, and the groove d2 is located in the gap between the brush plates d1, so The surface of the brush plate d1 is uneven, which is beneficial to increase the contact area between the brus...
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Abstract
The invention discloses an adhesive dispensing machine for a semiconductor apparatus. The adhesive dispensing machine is characterized by structurally comprising a machine body, an adhesive dispensingmachine body, a conveyor and a control panel, wherein the adhesive dispensing machine body is mounted on the top center position of the front surface of the machine body; and the conveyor is arrangedon the top surface of the machine body. While the adhesive dispensing machine is used to perform adhesive dispensing on the semiconductor apparatus, a telescopic tube moves vertically inside an adhesive dispensing tube according to amount of inlet adhesive inside the adhesive dispensing tube so as to reduce residual adhesive on the outer wall of the adhesive dispensing tube, so that direct contact between the adhesive dispensing tube and the surface of the apparatus is favorably reduced, the outer wall of the adhesive dispensing tube is kept clean, an adhesive drawing phenomenon is reduced, aqualification rate of semiconductor apparatus processing is favorably increased, and processed defective products are reduced; the outer wall of the telescopic tube is increased as part of adhesive is easily left on the outer wall of the telescopic tube; the telescopic tube moves vertically to movably fit to the inner part of a blocking block, and a clearing block clears a little adhesive left outside, so that the telescopic tube freely moves up and down inside the adhesive dispensing tube, and therefore, adhesive dispensing for the semiconductor apparatus is favorably quickened.
Description
technical field [0001] The invention belongs to the field of semiconductors, and more specifically, relates to a semiconductor device dispensing machine. Background technique [0002] Due to the controllable conductivity of semiconductors, semiconductor devices are widely used in various fields such as integrated circuits and lighting. When processing semiconductor devices, different semiconductor materials are glued on the surface of the material through a glue dispenser; In the prior art, when using a glue dispenser to dispense glue to semiconductor devices, because part of the glue is in a relatively viscous fluid state, when the dispensing tube is in contact with the semiconductor material, a small amount of glue adheres to the outside of the dispensing tube, and the workload of dispensing increases. , and the glue on the outside of the dispensing tube increases. When the dispensing tube moves up and down, the glue will drip down by gravity to form a wire drawing phenome...
Claims
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Application Information
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