Vapor chamber and manufacturing method for the same

Abstract

The present invention relates to a vapor chamber and manufacturing method for the same, the vapor chamber having upper and lower casings and a wick structure. The upper and lower casings have upper and lower heat exchange chamber areas having multiple upper and lower surface features thereon, separated by multiple upper and lower vapor areas therebetween, respectively. The upper and lower heat exchange chamber areas are surrounded by walls, having flat rims, respectively. The upper and lower heat exchange chamber areas form a vacuum chamber. An airtight sealed connection is formed at the flatrims of the surrounding walls of the upper and lower heat exchange chamber areas. Accordingly, a vapor chamber having an increasing condensing area and improved heat dissipating effect is provided toprevent deformation and leakage.

Description

technical field [0001] The invention relates to the technical field of heat conduction, in particular to a heat chamber for thermal management of a computer or an electronic device and a manufacturing method thereof. Background technique [0002] When a computer or electronic device is operating, it is necessary to quickly and efficiently discharge the heat generated by its internal central processing unit (CPU) or other processing units, so that its temperature can be kept within the design range. Today's central processing unit As components such as units are designed to be lighter, smaller and more powerful, more heat will be generated in a smaller space, making thermal management of electronic devices more challenging than ever. [0003] The thermal management technology of existing electronic devices mainly includes air-cooled and liquid-cooled. A vapor chamber in the form of a planar heat pipe can be used alone or connected with a heat conduction heat management system...

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Problems solved by technology

[0004] Generally speaking, the vapor chamber utilizes the liquid-gas-liquid phase change to achieve an overall isothermal heat transfer. The design of the vapor chamber should avoid deformation and leakage, and maximize the heat transfer efficiency. However, when As processing units become lighter, smaller and more powerful, more heat will be generated in a smaller space, even if the maximum heat transfer effect is sacrificed to avoid deformation or leakage of the existing vapor chamber. is quite difficult

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