Electronic chip crack detection device with turnover structure convenient for double-sided detection

Abstract

The invention discloses an electronic chip crack detection device with a turnover structure convenient for double-sided detection, and relates to the technical field of electronic chip detection, theelectronic chip crack detection device comprises a machine body, a workbench and a supporting mechanism, a cabinet is installed below the machine body, a cabinet door is arranged on the outer side ofthe cabinet, and the workbench is fixed above the cabinet. A supporting column is fixed to the outer side of the workbench, a control chamber is installed above the supporting column, a display screenis arranged in front of the control chamber, a rack is fixed to the lower middle portion of the control chamber, and a detection sensor is installed below the middle portion of the rack; the device has the beneficial effects that the front side and the rear side of the electronic chip main body can be elastically clamped under the elastic action of the springs through the two sets of symmetricalpositioning pads, and hard damage to the electronic chip main body is avoided; and the soft velvet layer on the upper side surface of the bearing plate is attached to the lower side surface of the electronic chip main body, so that the electronic chip main body can be prevented from being abraded.

Description

technical field [0001] The invention relates to the technical field of electronic chip detection, in particular to an electronic chip crack detection device with a flip structure for double-sided detection. Background technique [0002] Electronic chip is also called integrated circuit, or called microcircuit (microcircuit), microchip (microchip), chip / chip (chip). and are often fabricated on the surface of semiconductor wafers, the most advanced integrated circuits are the heart of microprocessors or multi-core processors that control everything from computers to cell phones to digital microwave ovens, which are controlled during the production of electronic chips Inspection to ensure the quality of its finished products. [0003] Existing electronic chip detection devices generally do not have a flip structure, nor can they realize the function of double-sided detection, and in the process of positioning and fixing the electronic chip, it is easy to cause wear or hard dam...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an electronic chip crack detection device with a flip structure for double-sided detection, so as to solve the problem that the existing electronic chip detection devices proposed in the background technology generally do not have a flip structure and cannot realize double-sided detection. Function, and in the process of positioning and fixing the electronic chip, it is easy to cause wear or hard damage to it, and there are limitations in the use

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