A kind of nanometer conductive and thermally conductive adhesive and its application

Abstract

The invention discloses a nanometer conductive and thermally conductive adhesive and an application thereof, comprising the following preparation materials: multi-walled carbon nanotubes coated with metal layers on the surface, nano solder fillers, epoxy resin system and flux, wherein the surface is coated with The carbon / metal weight ratio in the multi-walled carbon nanotubes of the metal layer is 1~1.2, the metal layer is doped with boron or silicon, and the doping amount of the boron or silicon is 5~1.2 of the total mass of the metal layer. 8%. The conductivity of metal-coated multi-walled carbon nanotubes is improved by doping boron or silicon in the metal-coated material; by adding carbon nanotubes, the specific surface of the conductive and thermally conductive adhesive is improved. The tubes are connected to form a three-dimensional conductive structure, which greatly improves the conductivity, reduces the amount of fillers, and saves production costs; nano-structured solder fillers are used to make them have better dispersion and larger specific surface area, and increase the same amount of addition. lower conductivity.

Description

technical field [0001] The invention relates to the technical field of preparation of electronic components, in particular to a nanometer conductive and thermally conductive adhesive and an application thereof. Background technique [0002] In recent years, with the continuous development of electronic technology and the continuous upgrading of electronic products, the size of their working components is getting smaller and smaller, and the operating speed is getting higher and higher, which makes their heat generation larger and larger. Therefore, in order to ensure their The stability of performance must be dissipated in time. In the process of fixing the flexible circuit and frame of electronic products, it is usually necessary to use tape to fix it. Traditional tapes do not have electrical and thermal conductivity, which affects the performance of electronic products. In the prior art, an electrically conductive and thermally conductive adhesive tape is usually used, wh...

AI Technical Summary

Problems solved by technology

Although the conductive and heat-conducting adhesives in the prior art have both electrical and heat-conducting functions, in order to ensure the electrical conductivity, it is usually necessary to add more conductive fillers to the conductive and heat-conducting adhesive, which not only greatly increases the production cost, but also There are problems with poor mechanical properties