Preparation method of micromechanical equipment

Abstract

The invention provides a preparation method of micromechanical equipment, which comprises the following steps of: bonding an MEMS wafer with a sealing cover surface, punching, etching, bonding with athrough hole surface, and anchoring the MEMS wafer serving as a device layer between two sides to provide higher rigidity for a corresponding mold. Meanwhile, thinning is conducted in the preparationprocess, jolt can be relieved and the requirement for getter can be eliminated through a small gap and / or a more controllable gap between the getter and the substrate, and the preparation cost is reduced.

Description

technical field [0001] The invention relates to the field of micromechanical device preparation, in particular to a method for preparing a micromechanical device. Background technique [0002] With the rapid development of modern electronic technology, various electronic devices such as navigation systems, cellular phones, and electronic games require sensors that can accurately determine the motion of the device at low cost with a small form factor. Conventional techniques have been developed to bump microelectromechanical systems (MEMS) chips on ASIC wafers or to integrate MEMS with ASIC wafers. However, there are many difficulties in the current preparation process that are worthy of improvement and progress: such as excessive parasitic capacitance caused by insulating vias, insufficient anti-bump and firmness in the field of inertial sensors, and high preparation costs using getters, etc. Therefore, there is an urgent need for a new preparation process to further reduce...

AI Technical Summary

Problems solved by technology

However, there are many difficulties in the current preparation process that are worthy of improvement and progress: such as excessive parasitic capacitance caused by insulating vias, insufficient anti-bump and firmness in the field of inertial sensors, high preparation costs using getters, etc.

Images