A method of manufacturing an embedded cavity and a PCB

A manufacturing method and a technology for burying a cavity, which are applied in the manufacture of printed circuits, printed circuits connected with non-printed electrical components, printed circuits, etc. , flow glue into the cavity and other problems, to achieve the effect of high alignment accuracy, simple and reliable production method, and good cavity shape

Active Publication Date: 2021-08-13
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the low-fluidity bonding sheet, this patent solution has better reliability, but in the process of pressing the prepreg, it is difficult to design the size and height of the glue-resisting protrusion due to poor control of glue flow Accurate matching, if there is a slight error, it will cause glue to flow into the cavity. This method of preparing the cavity has a particularly high requirement for the graphic design accuracy of the resist glue, and the operation is difficult

Method used

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  • A method of manufacturing an embedded cavity and a PCB
  • A method of manufacturing an embedded cavity and a PCB
  • A method of manufacturing an embedded cavity and a PCB

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Embodiment 1

[0045] see figure 1 , figure 2 , the present embodiment provides a method for manufacturing an embedded cavity, comprising the steps of:

[0046] Step 100, providing several core boards 10;

[0047] In this step, the core board 10 includes a first core board 11 and a second core board 12; a cavity area 111 is predetermined on the surface of the first copper foil layer of the first core board 11, and a predetermined circuit pattern 112 is made in the cavity area 111 ; The predetermined line pattern 112 includes a high-frequency signal line.

[0048] Wherein, the surface of the first copper foil layer of the first core board 11 is figure 2 The upper surface of the first core board 11.

[0049] Step 110, covering the cavity area 111 with the line shielding film 20;

[0050] In this embodiment, the circuit shielding film 20 is a high temperature resistant adhesive tape pasted on the cavity area 111 or an ink film coated on the cavity area to cover the predetermined circuit ...

Embodiment 2

[0075] This embodiment also provides a PCB, in which a closed cavity 70 is embedded, and the cavity 70 is manufactured according to the manufacturing method provided in the first embodiment.

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Abstract

The invention relates to the technical field of PCB, and discloses a method for manufacturing an embedded cavity and a PCB. The manufacturing method includes: providing a first core board and a second core board, covering the cavity area of ​​the first core board with a circuit shielding film, laminating and pressing the first core board and the second core board through prepregs to form a sub-board, A step groove covering the cavity area is provided on the sub-board, and the line shielding film is removed, and a supporting cover plate is made to block the opening of the step groove to form an airtight cavity. The present invention does not need to use low-fluidity prepreg, so it will not reduce the heat-resistant reliability of PCB. At the same time, the glue flow of the prepreg does not affect the shape of the cavity, so there is no need to prepare a resist pattern with high precision requirements. The method is simpler and more reliable, and the shape of the prepared cavity is good.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing an embedded cavity and a PCB. Background technique [0002] With the rapid development of the information industry and the electronics industry represented by smart electronic products, digital circuits have gradually entered the stage of high-speed information processing and high-frequency signal transmission. Development in the direction of reliability and low cost; and as the field of communication electronics gradually develops in the direction of high-frequency and high-speed signals, the low-loss transmission of high-frequency and high-speed signals in PCB signal lines, impedance continuity, etc. higher requirement. Therefore, a higher and more urgent demand is put forward for the low dielectric properties of copper clad laminates; realizing PCB substrate materials with low dielectric constant (Dk) and l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/32
CPCH05K1/185H05K3/321H05K2203/1322
Inventor 吴泓宇刘梦茹肖璐纪成光
Owner DONGGUAN SHENGYI ELECTRONICS
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