Supercharge Your Innovation With Domain-Expert AI Agents!

A method of manufacturing an embedded cavity and a PCB

A manufacturing method and a technology for burying a cavity, which are applied in the manufacture of printed circuits, printed circuits connected with non-printed electrical components, printed circuits, etc. , flow glue into the cavity and other problems, to achieve the effect of high alignment accuracy, simple and reliable production method, and good cavity shape

Active Publication Date: 2021-08-13
DONGGUAN SHENGYI ELECTRONICS
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the low-fluidity bonding sheet, this patent solution has better reliability, but in the process of pressing the prepreg, it is difficult to design the size and height of the glue-resisting protrusion due to poor control of glue flow Accurate matching, if there is a slight error, it will cause glue to flow into the cavity. This method of preparing the cavity has a particularly high requirement for the graphic design accuracy of the resist glue, and the operation is difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method of manufacturing an embedded cavity and a PCB
  • A method of manufacturing an embedded cavity and a PCB
  • A method of manufacturing an embedded cavity and a PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] see figure 1 , figure 2 , the present embodiment provides a method for manufacturing an embedded cavity, comprising the steps of:

[0046] Step 100, providing several core boards 10;

[0047] In this step, the core board 10 includes a first core board 11 and a second core board 12; a cavity area 111 is predetermined on the surface of the first copper foil layer of the first core board 11, and a predetermined circuit pattern 112 is made in the cavity area 111 ; The predetermined line pattern 112 includes a high-frequency signal line.

[0048] Wherein, the surface of the first copper foil layer of the first core board 11 is figure 2 The upper surface of the first core board 11.

[0049] Step 110, covering the cavity area 111 with the line shielding film 20;

[0050] In this embodiment, the circuit shielding film 20 is a high temperature resistant adhesive tape pasted on the cavity area 111 or an ink film coated on the cavity area to cover the predetermined circuit ...

Embodiment 2

[0075] This embodiment also provides a PCB, in which a closed cavity 70 is embedded, and the cavity 70 is manufactured according to the manufacturing method provided in the first embodiment.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of PCB, and discloses a method for manufacturing an embedded cavity and a PCB. The manufacturing method includes: providing a first core board and a second core board, covering the cavity area of ​​the first core board with a circuit shielding film, laminating and pressing the first core board and the second core board through prepregs to form a sub-board, A step groove covering the cavity area is provided on the sub-board, and the line shielding film is removed, and a supporting cover plate is made to block the opening of the step groove to form an airtight cavity. The present invention does not need to use low-fluidity prepreg, so it will not reduce the heat-resistant reliability of PCB. At the same time, the glue flow of the prepreg does not affect the shape of the cavity, so there is no need to prepare a resist pattern with high precision requirements. The method is simpler and more reliable, and the shape of the prepared cavity is good.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing an embedded cavity and a PCB. Background technique [0002] With the rapid development of the information industry and the electronics industry represented by smart electronic products, digital circuits have gradually entered the stage of high-speed information processing and high-frequency signal transmission. Development in the direction of reliability and low cost; and as the field of communication electronics gradually develops in the direction of high-frequency and high-speed signals, the low-loss transmission of high-frequency and high-speed signals in PCB signal lines, impedance continuity, etc. higher requirement. Therefore, a higher and more urgent demand is put forward for the low dielectric properties of copper clad laminates; realizing PCB substrate materials with low dielectric constant (Dk) and l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/32
CPCH05K1/185H05K3/321H05K2203/1322
Inventor 吴泓宇刘梦茹肖璐纪成光
Owner DONGGUAN SHENGYI ELECTRONICS
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com