A method of manufacturing an embedded cavity and a PCB

A manufacturing method and a technique of embedding cavities, which are applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit components, etc., can solve problems such as irregular cavities, and achieve good cavity appearance and high alignment accuracy , The production method is simple and reliable

Active Publication Date: 2021-08-13
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a method for manufacturing a built-in cavity and a PCB, which overcomes the defects in the prior art that the cavity is irregular due to glue flow

Method used

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  • A method of manufacturing an embedded cavity and a PCB
  • A method of manufacturing an embedded cavity and a PCB
  • A method of manufacturing an embedded cavity and a PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] see figure 1 , figure 2 , the present embodiment provides a method for manufacturing an embedded cavity, comprising the steps of:

[0058] Step 100 , providing several core boards 10 and several prepregs 30 .

[0059] In this step, the core board 10 includes a first core board 11 and a second core board 12; a predetermined circuit pattern 112 is made on the surface of the first copper foil layer of the first core board 11; the prepreg 30 includes a first prepreg 31 and a second prepreg 32. In this embodiment, common prepregs are used as prepregs; the predetermined circuit pattern 112 includes high-frequency signal lines.

[0060] Wherein, the surface of the first copper foil layer of the first core board 11 is figure 2 The upper surface of the first core board 11.

[0061] Step 110 , laying the line shielding layer 20 in the cavity area 111 .

[0062] The line shielding layer 20 can use an insulating gasket, a high temperature resistant tape or an ink film, etc.,...

Embodiment 2

[0098] This embodiment also provides a PCB, in which a closed cavity 60 is embedded, and the cavity 60 is manufactured according to the manufacturing method provided in the first embodiment.

[0099] It should be noted that, as a specific implementation of this embodiment, the stepped groove 50 is a two-stage stepped groove, which is formed with two stepped surfaces, that is, the edge of the first stepped groove 51 and the first stepped groove 51. bottom of the groove, which is only a preferred embodiment of the present invention, it can be understood that the stepped groove 50 can also adopt a first-level stepped groove (only one step surface) or a multi-level stepped groove above the second level (with two More than one step surface), all can form a cavity 60 with good shape, therefore, all of them should be within the protection scope of the present invention.

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Abstract

The invention relates to the technical field of PCB, and discloses a method for manufacturing an embedded cavity and a PCB. The manufacturing method includes: providing a first core board and a second core board, laying a line shielding layer in the cavity area, pressing the first core board and the second core board into a sub-board, and opening a cavity with a cover on the sub-board The stepped groove in the area, and remove the line shielding layer, insert the notch sealing part into the stepped groove, and fix the supporting cover plate and the sub-board to form a closed cavity. The present invention does not need to use low-fluidity prepreg, so it will not reduce the heat resistance reliability of PCB. At the same time, the glue flow of the prepreg does not affect the shape of the cavity, so there is no need to prepare a resist pattern with high precision requirements. The method is simpler and more reliable, and the obtained cavity has a good shape.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing an embedded cavity and a PCB. Background technique [0002] As the field of communication electronics gradually develops towards high-frequency and high-speed signals, higher requirements are put forward for high-frequency and low-loss transmission of high-speed signal lines in PCBs, and impedance continuity. At present, in addition to optimizing the layout design of PCB holes and lines, improving the signal transmission speed and reducing loss from the PCB processing technology is mainly through the use of media with lower Dk (dielectric constant) and Df (dielectric loss factor) as substrates and the use of rough However, these two directions have gradually emerged bottlenecks in the process of rapid development, and will face difficulties in 112G and future high-speed PCB applications. Since the Dk and Df of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0298H05K3/4611H05K3/4697
Inventor 刘梦茹吴泓宇肖璐纪成光
Owner DONGGUAN SHENGYI ELECTRONICS
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