Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Conveniently-adjusted cutting and grinding integrated equipment for computer chip processing

A technology of cutting and grinding, computer chips, applied in metal processing equipment, grinding/polishing equipment, welding equipment, etc., can solve the problems of inability to adjust, troublesome use, grinding and polishing of computer chips, etc., to achieve stable lifting and flexible use. Effect

Inactive Publication Date: 2020-12-25
东莞市夯牛机电科技有限公司
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a cutting and grinding integrated equipment that is easy to adjust for computer chip processing, so as to solve the problem that the existing cutting equipment for computer chip processing proposed in the above-mentioned background technology generally cannot grind the computer chip after the cutting is completed. Polishing needs to be sent to the next process for reprocessing, which is cumbersome to use, and cannot be adjusted for activities, and the problem of insufficient flexibility in use

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conveniently-adjusted cutting and grinding integrated equipment for computer chip processing
  • Conveniently-adjusted cutting and grinding integrated equipment for computer chip processing
  • Conveniently-adjusted cutting and grinding integrated equipment for computer chip processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all the embodiments, based on The embodiments of the present invention, and all other embodiments obtained by those of ordinary skill in the art without creative work, fall within the protection scope of the present invention.

[0029]In the description of the present invention, unless otherwise specified, "plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer" , "Front", "Back", "Head", "Tail", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, not Indicates ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses conveniently-adjusted cutting and grinding integrated equipment for computer chip processing, and relates to the technical field of computer chip processing. The conveniently-adjusted cutting and grinding integrated equipment includes a machine body, an adsorbing and fixing mechanism, a cutting mechanism and a grinding mechanism; a workbench is fixed above the machine body,and a cutting base is fixed above the workbench; a rear plate is mounted on the rear side of the upper part of the cutting base, protective covers are fixed to two sides of the upper part of the cutting base; a mounting frame is arranged above a position between the protective covers, and side sliding blocks are fixed to two ends of the mounting frame; a side sliding groove is formed in the innerside of the upper part of each of the protective covers; and an electric push rod is mounted below the mounting frame. The conveniently-adjusted cutting and grinding integrated equipment has the beneficial effects that miniature air pumps of the adsorbing and fixing mechanism of the equipment can be connected with adsorption grooves through air suction pipes and connecting pipes, so that negativepressures are generated in the adsorption grooves; and the lower side surface of a chip main body is conveniently adsorbed and fixed by the adsorption grooves which are equidistantly arranged, so that the chip main body is prevented from moving during processing.

Description

Technical field[0001]The invention relates to the technical field of computer chip processing, in particular to an integrated cutting and polishing equipment for computer chip processing that is easy to adjust.Background technique[0002]A computer chip is actually an electronic part. A computer chip contains thousands of resistors, capacitors and other small components. There are many chips on the computer. The black strips on the memory stick are the chips, the motherboard, the hard disk, and the graphics card. There are many chips on the waiting list, and the CPU is also a computer chip, and the originals need to be cut during the processing of the computer chip.[0003]Existing cutting equipment for computer chip processing generally cannot polish the computer chip after the cutting is completed, and needs to be sent to the next process for reprocessing, which is cumbersome to use, and cannot be adjusted in motion, and has insufficient flexibility in use. To this end, we propose an ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/70B24B9/06B24B47/12B24B41/02B24B41/06
CPCB23K26/38B24B9/06B24B41/02B24B41/06B24B47/12B23K26/702
Inventor 陈奕傧胡展铭郭钰儿
Owner 东莞市夯牛机电科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products