Dry-wet heat curing type heating die table for PC components
A damp-heat curing and mold table technology, applied in ceramic molding machines, auxiliary molding equipment, non-electric variable control, etc., can solve the problems of reduced maintenance effect of PC components, lack of material receiving function, and difficulty in unloading, and achieves increased maintenance. effect, increased protection, increased work efficiency
Active Publication Date: 2020-12-25
江苏上建舜杰预制构件有限公司
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Problems solved by technology
[0003] However, in the prior art, most maintenance-type heating mold tables for PC components cannot realize real-time temperature and humidity control, resulting in a reduction in the maintenance effect on PC components, and most maintenance-type heating mold tables for PC components do not have the ability to receive materials. Function, because it is difficult to directly complete the unloading of the larger PC components during the unloading process, it is easy to fall and be damaged
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[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0032] It is to be understood that the terms "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" The orientation or positional relationship indicated by ...
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The invention discloses a dry-wet heat curing type heating die table for PC components, and relates to the technical field of PC component curing. The dry-wet heat curing type heating die table comprises a base, a supporting frame, a discharging mechanism and a receiving mechanism, and is characterized in that the die table is fixedly mounted at the top of the base, a controller is fixedly mountedon the front surface of the base, a humidity sensor and a temperature sensor are fixedly installed in the die table, first electric cylinders are symmetrically and fixedly installed on the two sidesof the top of the supporting frame, and a cover body is arranged on the lower side of the supporting frame. According to the dry-wet heat curing type heating die table, on the premise that the sealingperformance between the die table and the cover body is guaranteed, the cover body is convenient to open and close, the curing work efficiency is improved, real-time control over the humidity and thetemperature can be achieved, the curing effect on the PC components is improved, and the device is convenient to discharge and has the receiving function; and the falling phenomenon of the PC components in the discharge process is prevented, and the protectiveness is improved.
Description
technical field [0001] The invention relates to the technical field of PC component maintenance, in particular to a dry and wet heat curing type heating mold table for PC components. Background technique [0002] PC component is a component used in construction, transportation, water conservancy and other fields. PC component refers to concrete products that are processed and produced by standardized and mechanized methods in factories. The corresponding traditional cast-in-place concrete requires on-site modeling, On-site pouring and on-site maintenance, precast concrete parts are widely used in construction, transportation, water conservancy and other fields, and play an important role in the national economy. Generally, during the processing of PC components, a heating die table needs to be used for curing operations in order to increase the performance of the PC components. [0003] However, in the prior art, most maintenance-type heating mold tables for PC components c...
Claims
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IPC IPC(8): B28B11/24B28B17/00G05D27/02
CPCB28B11/245B28B11/247B28B17/00G05D27/02
Inventor 刘俊强
Owner 江苏上建舜杰预制构件有限公司