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Electronic component

A technology of electronic components and capacitors, applied in the direction of electrical components, fixed capacitance parts, capacitors, etc., can solve problems that do not conform to the current trend of substrate mounting densification and multi-layer stacking

Pending Publication Date: 2020-12-25
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This results in a volume increase not only in the Z direction but also in the X and Y directions, thus going against current trends in densification and multilayer stacking in terms of substrate mounting

Method used

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Embodiment Construction

[0030] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0031] However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0032] Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0033] Therefore, the shapes and dimensions of elements in the drawings may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0034] Furthermore, throughout the figures, the same reference numerals are used for elements with similar functions and activities.

[0035] In the specification, unless otherwise expressly stated, when a certain component "includes" a certain component, it is understood that it may also include other components and not e...

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Abstract

The present invention provides an electronic component. The electronic component comprises: a capacitor body including a dielectric layer and first and second internal electrodes, and including firstand second surfaces facing each other, third and fourth surfaces connected to the first and second surfaces and facing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces and facing each other, wherein the first internal electrode is exposed through the third surface and the second internal electrode is exposed through thefourth surface; first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, so as to extend to a portion of the first surface, and connected to the firstand second internal electrodes, respectively; a shielding layer including a cap portion disposed on the second surface of the capacitor body and sidewall portions disposed on the third, fourth, fifth, and sixth surfaces of the capacitor body; and an insulating layer disposed between the capacitor body and the shielding layer. A part of a lower portion of the capacitor body is not covered by the insulating layer and the shielding layer, but exposed.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0074972 filed with the Korean Intellectual Property Office on June 24, 2019, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to an electronic component. Background technique [0003] Electronic components using ceramic materials are usually capacitors, inductors, piezoelectric elements, varistors or thermistors, etc. [0004] Electronic devices using such electronic components are becoming more efficient and miniaturized. Therefore, electronic components used in electronic equipment are also miniaturized and highly efficient. [0005] In particular, as mobile phones have become more efficient and thinner, multilayer lamination and densification of substrate mounting are continuing to develop. In this regard, RF performance in components can be degraded due to electromagnetic interference (EMI)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G2/22
CPCH01G2/22H01G2/20H01G4/002H01G4/12H01G4/224H01G4/30H01G2/065H01G4/232H01G4/012
Inventor 尹灿朴祥秀金汇大申旴澈赵志弘
Owner SAMSUNG ELECTRO MECHANICS CO LTD