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A heat dissipation cover grounding package structure and process thereof

A technology of packaging structure and heat dissipation cover, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of unstable connection, easy damage of heat dissipation cover, and high temperature fusing, etc., and achieve the stability of conduction Good, good heat dissipation effect, ensure the effect of grounding effect

Active Publication Date: 2022-08-02
ANHUI LONGXINWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a heat dissipation cover grounding packaging structure and its technology, which solves the problem that the one-way wire connection is easy to be blown by high temperature, and the grounding operation of the heat dissipation cover cannot be realized through continuous and stable cooperation, the connection is unstable, and the heat dissipation cover is easy. Damaged technical issues

Method used

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  • A heat dissipation cover grounding package structure and process thereof
  • A heat dissipation cover grounding package structure and process thereof
  • A heat dissipation cover grounding package structure and process thereof

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Embodiment approach

[0032] As an embodiment of the present invention, six rubber pads 51 are arranged in an annular matrix on the hole wall of the through hole on the inclined surface in the packaging board 2 , the positioning screw 53 is arranged corresponding to the rubber pad 51 , and the end surface of the positioning screw 53 is connected to the rubber pad 51 . tangent to the top side.

[0033] As an embodiment of the present invention, the pressurizing assembly 4 includes an extrusion screw 41, an air pressure gauge 42, a cylinder 43 and a piston 44. A piston 44 is installed inside the cylinder 43, and the extrusion screw 41 is threaded through the cylinder 43 through thread fit. Inside the top side wall of the cylinder 43, a gas pressure gauge 42 is fitted with the bottom of the cylinder 43.

[0034] As an embodiment of the present invention, the contact assembly 10 includes an extrusion airbag 101, a conductive plate 102, an expansion spring 103, a conductive ball 104, and a limit groove ...

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Abstract

The invention discloses a grounding package structure of a heat dissipation cover and a process thereof. It is installed on the base plate, and the top side of the packaging board is equipped with a pressurizing assembly. By setting the pressurizing assembly and the contact assembly, and rotating the extrusion screw, the piston can be pushed, and the gas in the cylinder can be introduced into the extrusion airbag. Inside, the airbag is squeezed to expand, which can push the conductive plate. With the cooperation of the expansion spring, the conductive ball can be guaranteed to be in contact with the ground pad. Similarly, the conductive ball of the pressurizing component under the heat dissipation plate is in contact with the heat dissipation plate, which can be more Good electrical conductivity can ensure the grounding effect. During the installation process, due to the pressure on the airbag, the expansion spring can be guaranteed to be in a compressed state. Stable, and the stability of electrical conductivity is better.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a grounding packaging structure of a heat dissipation cover and a process thereof. Background technique [0002] At present, there are usually two methods for grounding conduction of traditional PBGA heat dissipation cover: conductive glue and solder balls. The resistance of the grounding resistance is too large, and the potential of the grounding point is not zero, which makes it impossible to discharge to the ground normally, and it is easy to burn the internal circuit or hurt the people who come into contact with it. , There are non-conductive fillers in the conductive glue, and the separation or concentration of conductive substances and non-conductive substances leads to unstable resistance values, often due to the separation of conductive substances deposition and the resistance value is too large; [0003] When the existing heat dissipation cover is grounded and pack...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/40H01L23/367H01L23/60H01L21/50
CPCH01L23/4006H01L23/367H01L23/60H01L21/50H01L2023/4087
Inventor 黄晓波
Owner ANHUI LONGXINWEI TECH CO LTD
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