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Manufacturing method of micro light-emitting diode

A technology of light-emitting diodes and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as affecting MicroLED electrical contact, sticky substances are difficult to remove, and affect transfer yield, etc., to improve Transfer rate, process time and cost saving effect

Inactive Publication Date: 2020-12-25
NANJING CEC PANDA LCD TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The viscous transfer head using viscous adsorption force is widely used due to the characteristics of simple manufacture, low cost and high efficiency. After transfer, sticky substances will remain on the surface of the Micro LED and are difficult to remove, and will affect the electrical contact of the Micro LED
[0004] In addition, in the prior art, the photoresist is removed immediately after the etching of the Micro LED array is completed, and the residual glue on the surface of the micro LEDs is cleaned after the transfer with a transfer head. Because of the small size of the Micro LED, it is easy to remove the glue during the process. Drop and damage the surface of the LED, thus affecting the transfer yield

Method used

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  • Manufacturing method of micro light-emitting diode
  • Manufacturing method of micro light-emitting diode
  • Manufacturing method of micro light-emitting diode

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Embodiment Construction

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0029] In order to make the drawing concise, each drawing only schematically shows the parts related to the present invention, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, only one of the components having the same structure or function is schematically shown, or only one of them is marked. Herein, "a" not only means "only one", but also means "more than one".

[0030] The techni...

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Abstract

The invention provides a manufacturing method of a micro light-emitting diode, relates to the field of micro light-emitting diodes, and changes a traditional process sequence: in the process of manufacturing and transferring the micro light-emitting diode, a photoresist after etching of the micro light-emitting diode is firstly reserved, and the photoresist is used as an intermediate layer for transferring the micro light-emitting diode; and the photoresist is removed after transfer, so that the influence of residual glue on the micro light-emitting diode is avoided, the LED is not damaged, the transfer rate of the LED is also improved, and the process time and cost are saved.

Description

technical field [0001] The invention belongs to the field of miniature light-emitting diodes, and in particular relates to a method for manufacturing a miniature light-emitting diode. Background technique [0002] Micro LED (miniature light-emitting diode) has attracted widespread attention because of its use of inorganic light-emitting materials and its advantages of high luminous efficiency, long life, and high reliability. The respective growth substrates are picked up separately and then placed on the drive backplane. When picking up Micro LEDs, external forces are needed. Commonly used external forces include electrostatic adsorption, viscous adsorption, magnetic adsorption, and vacuum adsorption. [0003] The viscous transfer head using viscous adsorption force is widely used due to the characteristics of simple manufacture, low cost and high efficiency. After the transfer, sticky substances will remain on the surface of the Micro LED and are difficult to remove, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L21/683H01L21/67H01L33/00
CPCH01L27/156H01L21/6838H01L21/67144H01L33/00
Inventor 张有为周宇朱充沛高威
Owner NANJING CEC PANDA LCD TECH
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