Multi-head chip mounter suction nozzle feeder arrangement and component mounting sequence optimization algorithm
A sequence optimization and placement machine technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of inability to obtain the placement sequence, failure to achieve the same pick-up and minimum displacement, and reduced placement efficiency, so as to reduce labor costs and trial and error. The effect of reducing the cost of mistakes, saving labor costs, and reducing operating time
A sequence optimization and placement machine technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of inability to obtain the placement sequence, failure to achieve the same pick-up and minimum displacement, and reduced placement efficiency, so as to reduce labor costs and trial and error. The effect of reducing the cost of mistakes, saving labor costs, and reducing operating time
CN112165852APending Publication Date: 2021-01-01北京华维国创电子科技有限公司
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[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0041] see figure 1 and figure 2 , the present invention provides a technical solution: multi-head placement machine suction nozzle feeder arrangement and component placement sequence optimization algorithm, including algorithm method and algorithm system, algorithm method includes suction nozzle feeder arrangement algorithm method and placement path optimization Algorithm method, the nozzle feeder arrangement algorithm includes: the nozzle feeder arrangemen...
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The invention discloses a multi-chip mounter suction nozzle feeder arrangement and component mounting sequence optimization algorithm, which comprises an algorithm method and an algorithm system, andis characterized in that the algorithm method comprises a suction nozzle feeder arrangement algorithm method and a method of mounting path optimization algorithm; wherein the suction nozzle feeder arrangement algorithm comprises the following steps: outputting a suction nozzle installation list and a feeder installation list according to the types, the number, the feeding types, the feeder modelsand the suction nozzle models of original parts in an input PCB list; the method of the mounting path optimization algorithm comprises the step that the algorithm calculates an optimal mounting sequence according to a shortest mounting path rule. According to the algorithm, the operation efficiency of the multi-head chip mounter is improved, an optimized chip mounter suction nozzle feeder arrangement scheme and a mounting sequence are provided, the mounting time is greatly shortened, and the operation efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of chip mounters, and more specifically relates to the nozzle feeder arrangement of a multi-head chip mounter and an optimization algorithm for component mounting sequences. Background technique [0002] The workflow of the multi-head placement machine is that the multi-head goes to the feeder station to pick up multiple chip components, and after visual calibration, it moves to the placement position and places them one by one. The PCB component list includes the mounting coordinates of different components, the nozzle model, the feeding type and the feeder model. When retrieving, in order to maximize the efficiency, the multi-head placement machine needs to try to make the entire retrieving process as many as possible and minimize the displacement; when placing, in order to maximize the placement efficiency, the placement During each round of placement of the head, try to minimize the placement displaceme...
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Patent Timeline
01 Jan 2021
Publication
CN112165852A
- IPC
- H05K13/04; H05K13/08
- CPC
- H05K13/0409; H05K13/085
- Inventors
- 杨尊凯