A kind of semiconductor material production technology equipment

Abstract

The invention discloses a semiconductor material production technology equipment, the structure of which comprises a device main body, a controller, a sleeve shaft, a side removal device, a bracket, a polishing piece, and a hydraulic shaft. Beneficial effects: the present invention uses the provided soft protection mechanism to carry out side barriers for the wafer chips generated during the wafer process under the cooperation of the buckle, so as to prevent the waste chips generated by wafer grinding from being rotated by the rotating equipment. It is piled up on the side surface of the wafer, which is not conducive to the absorption of the waste by the equipment, which will cause the waste on the side to be rolled back to the wafer surface during the continuous polishing process of the wafer, resulting in uneven polishing of the wafer surface. The present invention cooperates with the stacking structure, and under the function of the softening part connected through it, the side scraps after scraping are absorbed and treated in a concentrated manner, so as to prevent them from staying on the side surface of the wafer.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, more precisely, a semiconductor material production technology equipment. Background technique [0002] Semiconductor material is a material with semiconducting properties, which is mostly used to make electronic materials such as semiconductor devices. [0003] When using polishing equipment to polish the surface of the wafer, the qualified condition of the finished wafer is that its surface is smooth and free of impurities before it can be put into use. It is absorbed by the equipment, and part of it moves to the side of the wafer under the cooperation of the rotating air flow, and stays on the side surface, which cannot be effectively absorbed, resulting in the waste debris that stays on the side during the back and forth grinding process of the wafer. There is an uneven surface that is rolled back to the wafer surface and overlapped with the wafer surface to polish the wafer...

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a semiconductor material production technology equipment to solve the problem of the prior art that when the wafer surface is polished and polished by polishing equipment, the quality of the finished wafer is qualified. It is smooth and free of impurities before it can be put into use. However, when grinding, it often occurs that some of the waste debris polished on the surface of the wafer is absorbed by the equipment, and part of it moves to the side of the wafer under the cooperation of the rotating air flow and stays on the surface of the wafer. Its side surface cannot be effectively absorbed, so that during the back-and-forth polishing process of the wafer, the waste debris retained on the side is likely to be rolled back to the surface of the wafer, and overlapped with the surface of the wafer for grinding, so that the surface of the wafer is polished. Uneven Surface Defects

Images