A kind of conductive foam and preparation method thereof

Abstract

The invention provides a conductive foam and a manufacturing method thereof. The conductive foam comprises a release paper, a plurality of uniformly distributed conductive foam bodies arranged on the release paper, and a plastic frame. The plastic frame includes multiple two plastic squares, connected by ribs between two adjacent plastic squares, the size of each plastic square matches the size of the conductive foam body, and each of the conductive foam bodies is arranged on a Inside the plastic grid. The conductive foam provided by the present invention is provided with a conductive plastic frame on the outside of the conductive foam body, which can improve the conductivity on the one hand, and on the other hand, the plastic frame can increase the strength of the conductive foam, thereby avoiding deformation of the foam when reposting Or slipping phenomenon, thus improving the transfer efficiency of conductive foam. The manufacturing method of the conductive foam provided by the invention is simple and easy to operate.

Description

technical field [0001] The invention relates to the field of foam, in particular to a conductive foam and a manufacturing method thereof. Background technique [0002] At present, conductive foam is widely used in various electronic communication equipment. According to different electronic devices, the specifications of conductive foam are also various. For micro electronic devices, such as mobile phones, the internal ultra-thin and ultra-small special-shaped conductive foam When the foam is attached, usually a processed special-shaped conductive foam is attached to the centrifugal paper, and then manually transferred to the corresponding electronic components one by one with tweezers. Since the foam is small and soft, when it is picked up with tweezers and then reposted, the foam will be deformed (such as warped) due to the strong gripping force of the tweezers, so that it cannot be placed exactly where it should be placed, or, because The clamping force is small and the ...

AI Technical Summary

Problems solved by technology

Because the foam is small and soft, when it is pinched with tweezers and then reposted, the foam will be deformed (such as warped) due to the strong clamping force of the tweezers, so that it cannot be placed exactly where it should be placed, or, because The clamping force is small and the foam will slip off when reposting, resulting in unnecessary waste of products

All in all, the above phenomena can lead to inefficiency in reposting

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