Semiconductor device and related method
A technology of conductors and electronic devices, applied in the field of electronic devices, can solve problems such as high cost, reduced reliability, and large package size
Pending Publication Date: 2021-01-12
AMKOR TECH SINGAPORE HLDG PTE LTD
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Problems solved by technology
[0002]
Previous semiconductor packages and methods of forming semiconductor packages were inappropriate, for example, resulting in excessive cost, reduced reliability, relatively low performance, or excessive package size
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[0079] Various examples of providing semiconductor devices and methods of manufacturing semiconductor devices are discussed below. Such examples are not limiting, and the scope of the appended claims should not be limited to the particular examples disclosed. In the following discussion, the terms "example" and "such as" are non-limiting.
[0080] The figures illustrate the general manner of construction, and descriptions and details of well-known features and techniques may be omitted so as not to unnecessarily obscure the present disclosure. Additionally, elements in the drawings are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the examples discussed in this disclosure. The same reference numerals in different figures denote the same elements.
[0081] The term "or" means any one or more items in the list joined by "or". As an example, "x o...
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Abstract
The present invention relates to a semiconductor device and a related method. In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from thefirst substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant;(b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant; (c) a second electronic component coupled to the first substrate top side; (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect; and (e) a cover structure on the first substrate and covering the secondcomponent sidewall and the first internal interconnect.
Description
technical field [0001] The present disclosure relates generally to electronic devices, and more particularly, to semiconductor devices and methods of fabricating semiconductor devices. Background technique [0002] Previous semiconductor packages and methods of forming semiconductor packages were inadequate, eg, resulting in excessive cost, reduced reliability, relatively low performance, or excessive package size. Other limitations and disadvantages of conventional and traditional methods will become apparent to those skilled in the art by comparing such methods with the present disclosure and with reference to the drawings. Contents of the invention [0003] In an example disclosed herein, an electronic device includes: a first substrate comprising: a first substrate top side; a first substrate bottom side; a first substrate sidewall; a first encapsulant from the first substrate bottom side extends to the first substrate top side; and a first substrate interconnect exte...
Claims
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IPC IPC(8): H01L25/065H01L21/98H01L23/31H01L21/50H01L21/56H01L21/60
CPCH01L25/0657H01L25/50H01L24/85H01L23/3157H01L23/3185H01L21/50H01L21/56H01L2225/0651H01L2224/85B81C1/0023B81C2203/0154B81C2203/0109B81B2207/096B81B7/0025B81C2203/0792H01L2924/181H01L2224/48091H01L2224/48227H01L2224/97H01L2924/10158H01L2924/16235H01L2924/15151H01L2924/00012H01L2924/00014H01L23/28H01L23/495H01L23/498B81B7/007B81C1/0088B81C1/00301B81C2201/034B81B2207/097
Inventor 欧宋杰
Owner AMKOR TECH SINGAPORE HLDG PTE LTD