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Circuit board with asymmetric structure, and manufacturing method thereof

A technology of asymmetric structure and manufacturing method, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve the problems of high manufacturing cost of circuit boards and the inability to effectively reduce the overall thickness of the board.

Pending Publication Date: 2021-01-15
JIANDING HUBEI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the circuit boards produced by the existing circuit board manufacturing methods have the problems of high manufacturing cost and the inability to effectively reduce the overall board thickness.

Method used

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  • Circuit board with asymmetric structure, and manufacturing method thereof
  • Circuit board with asymmetric structure, and manufacturing method thereof
  • Circuit board with asymmetric structure, and manufacturing method thereof

Examples

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Embodiment Construction

[0041] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0042] see figure 1 As shown, the method for manufacturing a circuit board with an asymmetric structure in the embodiment of the present invention includes the following steps:

[0043] S110: pre-steps, see figure 2 As shown, a substrate 11 is provided, and two opposite surfaces of the substrate 11 are defined as a first surface 111 and a second surface 112 , and an inner layer patterned circuit 12 is formed on the first surface 111 .

[0044] S120: layer-increasing step, see image 3 As shown, a dielectric layer 21 is formed on the first surface 111 of the substrate 11 , and the dielectric layer 21 entirely covers the inner patterned circuit 12 . A surface of the dielectric layer 21 away from the substrate 11 is defined as a third surface 211 .

[0045] S130: an outer layer patterning step, see Figure 4 As shown, a top surface patterne...

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PUM

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Abstract

The invention discloses a circuit board with an asymmetric structure, and a manufacturing method thereof, and relates to the field of manufacturing of circuit boards. The method comprises a pre-processing step, a layer adding step and an outer layer patterning step. According to the asymmetric circuit board manufactured through the pre-processing step, the layer adding step and the outer layer patterning step, the total number of circuit layers contained in the asymmetric circuit board is three (the inner layer patterning circuit, the bottom surface patterning circuit and the top surface patterning circuit), and therefore the asymmetric circuit board can have relatively low overall board thickness and relatively low manufacturing cost.

Description

technical field [0001] The invention relates to the field of circuit board manufacture, in particular to a circuit board with an asymmetric structure and a manufacturing method thereof. Background technique [0002] Generally speaking, the number of circuit layers contained in the circuit board manufactured by the existing manufacturing method is usually designed to be an even number of layers. For example, conventional circuit boards usually have four, six, or eight layers of circuit layers. However, the circuit board produced by the existing circuit board manufacturing method has the problems of high manufacturing cost and the overall board thickness cannot be effectively reduced. [0003] Therefore, how to provide a method of manufacturing a circuit board with an asymmetric structure through the improvement of structural design, to reduce the manufacturing cost and overall board thickness of the circuit board, and to overcome the above-mentioned defects has become the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0298H05K3/4644
Inventor 徐娓娓张涛杨海孙奇吕政明
Owner JIANDING HUBEI ELECTRONICS CO LTD