A kind of LED display unit group and display panel

Abstract

The invention discloses an LED display unit group and a display panel. The LED display unit group includes: a first insulating layer to an Nth insulating layer stacked in sequence, N≥2; a metal circuit layer arranged between adjacent insulating layers; The pin layer is set on the side of the first insulating layer away from the second insulating layer, and the pin layer includes a plurality of pins; the pad layer is set on the side of the Nth insulating layer away from the N-1th insulating layer, soldered The disk layer includes a plurality of pads that are insulated from each other; n rows and m columns of pixel units are arranged in an array, and each pixel unit includes at least one LED light-emitting chip, which is arranged on the side of the pad layer away from the Nth insulating layer. The pads are electrically connected to the LED light-emitting chip, n≥2, m≥2; metal vias are provided in one-to-one correspondence with multiple pads, and the pads are electrically connected to the metal circuit layer and / or pin layer through the metal vias. The invention further reduces the size of the display unit group while ensuring the stability of the circuit, and at the same time improves the contrast of the LED display unit group.

Description

technical field [0001] The invention relates to the technical field of LED display, in particular to an LED display unit group and a display panel. Background technique [0002] With the continuous improvement of indoor display application technology, indoor small-pitch LED display will become the main technology development space in the future, and will replace LCD and DLP indoor high-definition display products. The pixel unit density requirements of indoor small-pitch LED displays are getting higher and higher, namely The pitch between pixel units is required to be smaller and smaller. [0003] Existing small-pitch display screens mainly use 2121, 1515, 1010, 0808 and other independent packaged devices, each packaged device includes 4 pins, and the pins of multiple independently packaged devices are welded on the PCB to form a display panel. With the rapid development of LED display screens towards small pitches, the size of the corresponding light-emitting units is als...

AI Technical Summary

Problems solved by technology

However, the pads and metal traces in the packaging module occupy most of the area, which reduces the contrast of the packaging module

And in the case that the size of the pads and metal traces remains unchanged, it is difficult to further reduce the size of the package module. If the size of the pads and metal traces is reduced, the line resistance will increase and the circuit stability will deteriorate.

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