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Transistor packaging equipment

A technology for packaging equipment and transistors, which is used in transportation and packaging, semiconductor/solid-state device manufacturing, conveyor objects, etc., and can solve problems such as incorrect calculation of the number of clamps

Inactive Publication Date: 2021-01-26
潘屿芬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on the discovery of the above inventors, the existing methods mainly have the following disadvantages, for example: when clamping two transistors with different volumes and overlapping, because the clamping device scans the volume of the object to be clamped below calculation, and when the volume of the upper transistor is smaller than that of the lower one, the equipment will clamp two overlapping transistors together into the loading tray, resulting in an error in the calculation of the clamping quantity

Method used

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  • Transistor packaging equipment
  • Transistor packaging equipment
  • Transistor packaging equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0024] as attached figure 1 to attach Figure 5 Shown:

[0025] The present invention provides a transistor packaging device, the structure of which includes a clamping mechanism 1, a loading tray 2, a conveyor belt 3, and a cabin body 4. The clamping mechanism 1 is embedded and installed directly above the loading tray 2, and the loading tray 2 It is installed on the right side of the conveyor belt 3 by welding, and the conveyor belt 3 is embedded and installed on the left side of the cabin body 4, and the cabin body 4 is located directly below the clamping mechanism 1; the clamping mechanism 1 includes moving wheels 11. Hydraulic pipe 12, movable rod 13, claw 14, and screening mechanism 15. The moving wheel 11 is symmetrically installed on the left and right sides of the upper end of the screening mechanism 15. The hydraulic pipe 12 is inlaid and mounted on the positive side of the claw 14. Above, the movable rod 13 is symmetrically installed on the left and right ends of ...

Embodiment 2

[0032] as attached Figure 5to attach Figure 7 As shown: the movable block 153 includes an adsorption strip 531, an inlaid bead 532, a magnetic ball 533, a wrapping layer 534, a chute 535, and a second spring 536, and the adsorption strip 531 is embedded and installed on the upper left side of the adsorption strip 5312 On the surface, the inlaid beads 532 are movably mounted on the left end of the chute 535, the magnetic balls 533 are inlaid and arranged directly under the adsorption strip 531, and the wrapping layer 534 is inlaid and installed on the right side of the inlaid beads 532. The lower end of the side, the inner end surface of the chute 535 is movably engaged with the inlaid bead 532, the second spring 536 is located on the right side of the inlaid bead 532, and the chute 535 and the lower end of the guide rail 151 are vertically designed. When the movable block 153 is pushed to slide upwards, the movable block 153 can slide along the guide of the arc tube 511 wit...

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Abstract

The invention discloses transistor packaging equipment which structurally comprises a clamping mechanism, a loading disc, a conveying belt and a cabin, the clamping mechanism is fixedly installed overthe loading disc in an embedded mode, the loading disc is installed on the right side of the conveying belt in a welded mode, the conveying belt is fixedly installed on the left side of the cabin inan embedded mode, and the cabin is located under the clamping mechanism. A transistor with a small size can be embedded into an inclined conical angle formed by two movable blocks, and the crystallinelens can gradually drive the movable blocks to be lifted upwards along with the descending of the clamping mechanism, so that embedded beads in the movable blocks are embedded with the movable blocksto gradually slide upwards along the inner contour of a guide rail until the embedded beads slide to an arc tube; the magnetic ball and the magnet attract each other to form a movable shaft state, and the embedded bead at the upper end drives the movable block to swing by taking the magnetic ball as a fulcrum along with continuous extrusion of the transistor, so that the movable block is jacked up outwards along the movable groove to form a blocking effect on the clamping jaw, and clamping number errors caused by clamping the transistor below again by the clamping jaw are avoided.

Description

technical field [0001] The invention belongs to the field of transistors, and more specifically relates to a transistor packaging device. Background technique [0002] Transistor packaging equipment is a kind of transistor that is placed on the conveyor belt after being transported by the manipulator, neatly clamped and placed in the loading tray, and then the cover is pressed on the upper surface of the loading tray to complete the packaging, and finally the packaged transistor is delivered To the outside of the equipment, enter the next process. [0003] Based on the discovery of the above inventors, the existing methods mainly have the following disadvantages, for example: when clamping two transistors with different volumes and overlapping, because the clamping device scans the volume of the object to be clamped below calculation, and when the volume of the upper transistor is smaller than that of the lower one, the equipment will clamp two overlapping transistors toget...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67126H01L21/67703
Inventor 潘屿芬
Owner 潘屿芬