Rubber coating mechanism for directly coating wires with rubber and rubber coating process thereof

Abstract

The invention relates to a rubber coating mechanism for directly coating wires with rubber, the rubber coating mechanism comprises a first base plate, an X-direction guide rail, a rubber coating pushing cylinder, a second base plate, a rubber coating assembly mechanism and the like, and the rubber coating assembly mechanism comprises a rubber strip coating mechanism, a rubber strip conveying mechanism, a rubber strip mounting mechanism and a rubber strip cutting mechanism. According to the rubber coating mechanism, not only can the wires be directly coated with the rubber, but also rubber coating of the wires can be completed in the same process, the problems of loose conveying, deviated conveying and unsmooth conveying caused by high conveying resistance of a rubber strip in the conveyingprocess are solved, and the rubber coating mechanism is suitable for coating the wires of different specifications and different heights with the rubber and has the advantages of being high in rubbercoating efficiency, high in rubber coating precision, good in rubber coating effect, convenient to use and high in universality. The problems of long rubber coating time, low rubber coating efficiency, low rubber coating precision and a poor rubber coating effect due to the fact that rubber coating operation cannot be directly carried out on a wire by rubber coating equipment and a rubber coatingprocess on the market at present are effectively solved.

Description

technical field [0001] The invention relates to an encapsulation mechanism directly encapsulating a wire material and an encapsulation process thereof. Background technique [0002] At present, the glue coating equipment and glue wrapping process on the market are to send the wire to the winding station and the tape to the glue wrapping station respectively. After the wire has completed the winding operation at the winding station, it is then transferred to the Go to the encapsulation station for encapsulation operation. The encapsulation equipment and encapsulation process of this type of structure cause the wire winding and encapsulation to be carried out in two separate processes. It cannot be realized that the encapsulation operation can be performed directly on the wire, thus As a result, it has the disadvantages of long time required for glue wrapping, low glue wrapping efficiency and low glue wrapping precision, and in the process of conveying and wrapping the tape, t...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a glue-coating mechanism and its glue-coating process directly on the wire rod. It is completed in the same process, and overcomes the problems of loose transmission, offset transmission and unsmooth transmission caused by large transmission resistance during the transmission process of the tape, and it is suitable for wrapping wires of different specifications and heights It has the advantages of high encapsulation efficiency, high encapsulation precision, good encapsulation effect, convenient use and strong versatility. The lagging operation on the material leads to the problems of long lagging time, low lagging efficiency, low lagging precision and poor lagging effect

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