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Defect detection method for multilayer flexible circuit board

A flexible circuit board and defect detection technology, which is used in measurement devices, material analysis by optical means, instruments, etc., can solve the problem of insufficient AOI detection efficiency twice, and achieve the effect of improving detection efficiency

Pending Publication Date: 2021-02-02
苏州维信电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides a multi-layer flexible circuit board defect detection method to solve the problem that the efficiency of two AOI detections in the traditional detection process is not high enough

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  • Defect detection method for multilayer flexible circuit board
  • Defect detection method for multilayer flexible circuit board
  • Defect detection method for multilayer flexible circuit board

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Embodiment Construction

[0040] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0041] For multi-layer flexible circuit boards, the embodiment of the present invention provides a defect detection method for flexible circuit boards, such as Figure 1-3 shown, including:

[0042] Step S10, uncovering the first circuit board to obtain the first pattern.

[0043] Such as figure 2 As shown, the first circuit board includes a polyimide fil...

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Abstract

The invention discloses a defect detection method for a flexible circuit board. The defect detection method comprises the following steps: opening a cover on a first circuit board to obtain a first pattern; shielding the first circuit area exposed in the first pattern to obtain a second pattern; detecting the first circuit board, wherein the first circuit area is arranged on the second circuit board; and laminating the first circuit board over the second circuit board. After the laminating and uncovering process of the multi-layer flexible circuit board, the circuit of the uncovering area is shielded, the waste tearing condition of the uncovering part and the circuit area of the outer-layer circuit board after uncovering are detected at the same time, two times of circuit process detectionin the prior art are combined, and the detection efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board production, in particular to a defect detection method for a multilayer flexible circuit board. Background technique [0002] With the development of Flexible Printed Circuit (FPC) technology, the high-density / difficult circuit design of electronic products puts forward higher requirements for Automated Optical Inspection (AOI) systems; on the other hand, with The increase in labor costs and equipment costs, improving the efficiency of automatic optical inspection, improving production and quality have become the trend to improve the company's core competitiveness. [0003] At present, the AOI inspection process of the existing FPC circuit manufacturing process in the industry is generally: development, etching, film removal (Developing, Etching, Stripping, DES) process; FPC multilayer board outer circuit AOI inspection process; laser / punching / opening (laser / punch / decap) process; A...

Claims

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Application Information

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IPC IPC(8): G01N21/956
CPCG01N21/956G01N2021/95638
Inventor 杨鸣亮徐雨璐
Owner 苏州维信电子有限公司
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