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Coil electronic component

A technology of electronic components and coils, applied in the direction of coils, coil manufacturing, electrical components, etc.

Pending Publication Date: 2021-02-02
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet this requirement, it is necessary to increase the ratio of the magnetic material in the core filled with the magnetic material, but there is a limit to increasing the ratio due to the strength of the inductor body and the change in frequency characteristics caused by the insulation performance

Method used

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  • Coil electronic component
  • Coil electronic component
  • Coil electronic component

Examples

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Embodiment Construction

[0034] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0035] However, this disclosure may be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0036] Throughout the specification, it will be understood that when an element (such as a layer, region, or wafer (substrate)) is referred to as being "on," "connected to," or "bonded to" another element, When an element is used, the element may be directly "on", "connected to" or "coupled to" the other element, or there may be other elements intervening therebetween. element. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element, there...

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Abstract

The invention provides a coil electronic component. The coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0089738 filed with the Korean Intellectual Property Office on July 24, 2019, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a coil electronic assembly. Background technique [0003] As electronic devices such as digital televisions, mobile phones, and laptop PCs are miniaturized and thinned, coil components used in these electronic devices are required to be made smaller and thinner. In order to meet these purposes, research and development are being actively conducted on coil electronic components having various forms of wiring or thin films. [0004] The main problem with the miniaturization and thinning of electronic components according to coils is to provide the same performance as that of conventional coil components despite such miniaturization and thinning. In order to meet this req...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/30H01F27/32H01F17/04
CPCH01F27/306H01F27/324H01F17/04H01F2017/048H01F27/292H01F17/0013H01F27/2828H01F1/06H01F5/04H01F27/255H01F41/04
Inventor 田亨镇权纯光吴善羽
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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