Multi-layered ceramic capacitor
A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, capacitors, fixed capacitors, etc., and can solve problems such as poor bonding strength
Active Publication Date: 2021-02-02
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology
[0005] However, in the lower electrode applied to low-profile capacitors having a very small thickness, such as embedded capacitors and surface mount capacitors, the gap between the lower electrode and the metal plating layer poor bond strength between
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[0023] Hereinafter, embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. However, this disclosure may be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein. In addition, the embodiments of the present disclosure may be provided to make the description of the present disclosure more complete for those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be exaggerated for clarity of description, and elements denoted by the same reference numerals in the drawings may be the same elements.
[0024] In order to clearly illustrate the present disclosure, parts irrelevant to the description are omitted, and the thicknesses are exaggerated for clearly showing layers and regions, and throughout the specification, the same parts having the same function in the same range are denoted by the same reference numerals . Throughou...
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Abstract
The invention provides a multi-layered ceramic capacitor. The multilayer ceramic capacitor comprises: a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer therebetween; a first through electrode connected to the first internal electrode through the body; a second through electrode connected to the second internal electrode through the body; first and second external electrodes disposed on the first and second surfaces and connected with the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected with the second through electrode. The first to fourth external electrodes are plastic electrodes containing nickel, and include a first plating layer and asecond plating layer sequentially stacked on the plastic electrode.
Description
[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0094177 filed with the Korean Intellectual Property Office on Aug. 2, 2019, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a multilayer ceramic capacitor. Background technique [0003] Recently, the use of electronic devices using multilayer ceramic capacitors (MLCCs) has rapidly increased. In particular, as the fifth generation (5G) era has come, smartphones require capacitors of greater number and higher capacitance. On the other hand, since the mounting area of passive components such as MLCCs and inductors has been reduced due to the miniaturization technology of group products, miniaturization and slimming of passive components are also required. Therefore, a method of packaging multilayer ceramic capacitors and inductors together with integrated circuits (ICs) and application proces...
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IPC IPC(8): H01G4/232H01G4/30H01G4/12
CPCH01G4/30H01G4/232H01G4/12H01G4/012H01G4/1218H01G4/0085H01G4/1209H01G4/2325H01G2/065H01G4/302H01G2/02
Inventor 李泽正权炳燦朱镇卿赵志弘
Owner SAMSUNG ELECTRO MECHANICS CO LTD