Ceramic heating body, atomizer, electronic atomization device and preparation method of ceramic heating body
A technology of electronic atomization device and ceramic heating body, applied in the field of atomizer, can solve problems such as poor bonding strength, and achieve the effects of preventing cracking, enhancing bonding force and prolonging service life
Pending Publication Date: 2021-02-05
SHENZHEN SMOORE TECH LTD
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Problems solved by technology
[0004] In view of this, the present invention provides a ceramic heating element, an atomizer, an electronic atomization device, and a preparation method of a ceramic heating element to solve the technical problem of poor bonding strength between the ceramic substrate and the metal heating film in the prior art
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[0046] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present invention, but not to limit the scope of the present invention. Likewise, the following embodiments are only some but not all of the embodiments of the present invention, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0047]The terms "first", "second", and "third" in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at ...
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Abstract
The invention discloses a ceramic heating body, an atomizer, an electronic atomization device and a preparation method of the ceramic heating body. The ceramic heating body comprises a ceramic base body and a heating layer. The heating layer is attached to the surface of the ceramic substrate, wherein a plurality of microgrooves are formed in the surface, in contact with the heating layer, of theceramic substrate; in the direction parallel to the surface of the ceramic substrate, the maximum size of the cross section of the microgroove is larger than the opening size of the microgroove, the binding force of the heating layer and the ceramic in the ceramic heating body is enhanced, the contact surface of the heating layer and the ceramic is prevented from cracking to the maximum extent, then the heating layer is prevented from falling off, and the service life of the ceramic heating body is prolonged.
Description
technical field [0001] The invention relates to the technical field of atomizers, in particular to a preparation method of a ceramic heating element, an atomizer, an electronic atomization device and the ceramic heating element. Background technique [0002] The ceramic heating element has the advantages of corrosion resistance, high temperature resistance, long life and good thermal conductivity, and is widely used in the field of electronic atomization technology. The ceramic heating element mainly consists of two components: a ceramic substrate and a metal heating film. The heating film is usually printed directly on the ceramic body in the form of electronic paste, and then undergoes high-temperature baking, electrode and lead treatment processes to obtain a ceramic heating element. [0003] However, due to the large difference in the uniformity of the distribution of pores on the ceramic surface, the bonding strength between the ceramic substrate and the metal heating f...
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IPC IPC(8): A24F40/46
CPCA24F40/46
Inventor 张钊罗洪梁肖从文
Owner SHENZHEN SMOORE TECH LTD