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Optical formation using pick-up tools

A technology of tools and optical components, applied in the field of semiconductor device manufacturing, can solve problems such as brightness limitation, and achieve the effect of reducing error sources and reducing errors

Active Publication Date: 2022-08-09
CTRL LABS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, manipulating such tiny LEDs can be challenging
Also, the brightness of such tiny LEDs may be limited by the size of the LED

Method used

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  • Optical formation using pick-up tools
  • Optical formation using pick-up tools
  • Optical formation using pick-up tools

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Embodiment Construction

[0016] In the following description, for purposes of explanation, specific details are set forth in order to provide a thorough understanding of certain inventive embodiments. It will be apparent, however, that various embodiments may be practiced without these specific details. The drawings and descriptions are not intended to be limiting.

[0017] Disclosed herein are techniques that can reduce errors during the fabrication of semiconductor devices such as LEDs and photodiodes. In some embodiments, the fabricated semiconductor devices are tiny inorganic LEDs called micro LEDs, with optical elements formed thereon. Example optical elements include, but are not limited to, lenses, waveguides, and / or diffraction gratings. As used herein, a micro LED may refer to an LED having an active light emitting area with a linear dimension of less than 50 μm, less than 20 μm, or less than 10 μm. For example, linear dimensions can be as small as 2 μm or 4 μm.

[0018] Semiconductor d...

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PUM

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Abstract

Techniques related to optical formation using a pick-up tool (506) are disclosed. An optical element (508) is formed by pressing a pick-up tool (PUT) (506) against an elastomeric material (504) deposited on the light output side of the light emitting diode (LED) device. Pressing the PUT (506) against the elastomeric material (504) transfers the molded shape of the PUT (506) to the elastomeric material (504). This forms the optical element (508) in the elastomeric material.

Description

Background technique [0001] The present disclosure relates generally to semiconductor device fabrication, and more particularly to forming optical elements on semiconductor devices. [0002] Semiconductor devices have become commonplace in electronic products for providing benefits such as reduced size, improved durability, and increased efficiency. For example, in contrast to incandescent light bulbs, light-emitting diodes (LEDs) are generally smaller, last several times longer, and convert proportionally more energy into light than heat. Accordingly, semiconductor devices have even been incorporated into display systems, such as those found in televisions, computer monitors, laptop computers, tablet computers, smart phones, and wearable electronics. In particular, tiny LEDs can be used to form sub-pixels of display systems. However, manipulating such tiny LEDs can be challenging. Additionally, the brightness of such tiny LEDs may be limited by the size of the LEDs. SUMM...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29D11/00H01L33/54
CPCB29D11/00365B29D11/00298B29D11/00807H01L2933/0058H01L33/58H01L33/20H01L33/62H01L27/156H01L25/0753H01L21/67144H01L33/06H01L33/0093
Inventor D·布罗多塞努P·J·休格斯P·萨科蒂A·O·托伦特斯
Owner CTRL LABS CORP