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Electronic device

A technology of electronic devices and electronic components, applied in circuits, output power conversion devices, electrical components, etc., can solve problems such as gaps in insulating sheets, decreased thermal conductivity, and insufficient heat dissipation, so as to improve thermal conductivity and heat dissipation sexual effect

Pending Publication Date: 2021-02-09
SHINDENGEN ELECTRIC MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when an insulating sheet is provided, there is a problem that the thermal conductivity is lowered due to the unavoidable formation of voids between the insulating sheets.
[0003] Japanese Patent Laid-Open No. 2014-56868 proposes a method of securing heat dissipation by using a resin with good thermal conductivity, but this method is still insufficient from the viewpoint of heat dissipation
[0004] In addition, in the past, such as Japanese Patent Laid-Open No. 5-283247, a scheme of resin sealing the coil was proposed, but this scheme only simply resin-sealed a single coil.

Method used

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0062] "constitute"

[0063] In this embodiment, "one side" means image 3 The upper side of the , "the other side" means image 3 the lower side of the image 3 The up and down direction of the paper is called the "first direction", the left and right directions are called the "second direction", and the front and back directions on the paper are called the "third direction". The in-plane direction including the second direction and the third direction is called "plane direction".

[0064] like figure 1 As shown, the electronic device of this embodiment includes: a primary coil 10; a secondary coil 20 disposed opposite to the primary coil 10 on one side or the other side of the primary coil 10 (refer to image 3 ); the coil sealing part 50 (refer to figure 2 ); used to seal the primary side sealing portion 150 of the primary side electronic component 110 electrically connected to the primary coil 10 (refer to figure 2 ); and the secondary side sealing portion 250 for ...

no. 2 approach

[0085] Next, a second embodiment of the present invention will be described.

[0086] like Figure 10 As shown, in this embodiment, the first bent portion 310 is provided on the primary side terminal 60 between the coil sealing portion 50 and the primary side sealing portion 150 . Other configurations are the same as those of the first embodiment, and all the configurations described in the first embodiment can be employed. Components already described in the first embodiment will be described using the same symbols in this embodiment.

[0087] According to the present embodiment, the coil sealing portion 50 and the secondary side sealing portion 250 can be arranged along the plane direction, and can also be bent at a predetermined angle (for example, 60 degrees, 90 degrees, 120 degrees, etc.) with respect to the plane direction. The primary side sealing portion 150 is arranged in the direction. In this way, it is possible to reduce the dimension in a certain surface direct...

no. 3 approach

[0091] Next, a third embodiment of the present invention will be described.

[0092] like Figure 11 As shown, in this embodiment, the second bent portion 320 is provided on the secondary side terminal 70 between the coil sealing portion 50 and the secondary side sealing portion 250 . Other configurations are the same as the first embodiment, and all the configurations described in the first embodiment can be adopted. Components already described in the first embodiment will be described using the same symbols in this embodiment.

[0093] According to the present embodiment, the coil sealing portion 50 and the primary side sealing portion 150 can be arranged along the plane direction, and the two can be arranged along a direction bent at a predetermined angle (for example, 60 degrees, 90 degrees, 120 degrees, etc.) with respect to the plane direction. The secondary side sealing portion 250 . In this way, it is possible to reduce the dimension in a certain surface direction....

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PUM

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Abstract

An electronic device comprises: a primary coil 10; a secondary coil 20 which is arranged so as to face the primary coil 10; a coil sealing part 50 which is composed of a sealing resin that seals the primary coil 10 and the secondary coil 20; a primary-side sealing part 150 which seals a primary-side electronic element 110 that is electrically connected to the primary coil 10; and a secondary-sidesealing part 250 which seals a secondary-side electronic element 210 that is electrically connected to the secondary coil 20.

Description

technical field [0001] The invention relates to an electronic device with a primary coil and a secondary coil. Background technique [0002] Conventionally, in an electronic device such as a transformer having a primary coil and a secondary coil, in order to maintain electrical insulation in each coil, an insulating sheet is generally provided between steps constituting each coil. However, when insulating sheets are provided, there is a problem that thermal conductivity is lowered because voids are unavoidably formed between the insulating sheets. [0003] Japanese Patent Application Laid-Open No. 2014-56868 proposes a method of securing heat dissipation using a resin having good thermal conductivity, but this method is still insufficient from the viewpoint of heat dissipation. [0004] In addition, in the past, Japanese Patent Laid-Open No. 5-283247 also proposed a solution of resin sealing the coil, but this solution simply performs resin sealing of a single coil. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/32H01F27/28H02M3/28
CPCH02M1/0064H02M3/003H01F27/327H01F27/2876H01F27/22H01F27/29
Inventor 池田康亮比留间义明
Owner SHINDENGEN ELECTRIC MFG CO LTD