A printed circuit board heat exchanger

A technology for printed circuit boards and heat exchangers, applied in indirect heat exchangers, heat exchanger types, heat exchanger shells, etc., can solve the problems of inconsistent flow, affecting heat exchange performance, etc., to reduce inlet resistance, improve Heat transfer performance, improving the effect of uneven fluid flow

Active Publication Date: 2022-05-17
WUHAN SECOND SHIP DESIGN & RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a printed circuit board heat exchanger, which is used to solve the problem that in the existing printed circuit board heat exchanger, the flow rate of the fluid from the inlet channel into each layer of the fluid channel is inconsistent, which affects its heat transfer performance.

Method used

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  • A printed circuit board heat exchanger
  • A printed circuit board heat exchanger
  • A printed circuit board heat exchanger

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Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] In the description of the embodiments of the present invention, it should be noted that unless otherwise specified and limited. The directions of "left" and "right" are all subject to the directions shown in the attached drawings. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments ...

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Abstract

The embodiment of the present invention relates to the technical field of heat exchangers, and provides a printed circuit board heat exchanger. The printed circuit board heat exchanger includes a spiral structure and stacked multi-layer heat exchange plates, the heat exchange plates are provided with through holes, and the through holes of the multi-layer heat exchange plates are connected to form an inlet channel. The inlet of the fluid channel between the layers of heat exchange plates communicates with the inlet channel, and the spiral structure is arranged in the inlet channel. The vertical flow of the fluid in the inlet channel is converted into a helical flow by arranging a spiral structure in the inlet channel, so that the angle between the flow velocity direction of the fluid and the heat exchange plate is reduced, and centrifugal force is generated. Under the action of centrifugal force, it enters the fluid channels of each layer, which reduces the inlet resistance of the fluid entering the fluid channels, improves the problem of uneven flow of fluid entering each layer of fluid channels, and improves the heat transfer performance of the printed circuit board heat exchanger. .

Description

technical field [0001] The invention relates to the technical field of heat exchangers, in particular to a printed circuit board heat exchanger. Background technique [0002] The printed circuit board heat exchanger is made by stacking and welding the heat exchange plates engraved with fine channels by diffusion welding technology. It has the characteristics of compact structure and strong pressure bearing capacity. Broad application prospects. [0003] Each heat exchange plate of the printed circuit board heat exchanger is provided with two through holes at the corresponding positions. After stacking multiple heat exchange plates, two inlet channels of the plate heat exchanger are formed. After the hot fluid and the cold fluid are passed into different inlet channels respectively, they enter the fluid channels between the heat exchange plates of each layer from the inlet channels. However, since the velocity direction of the fluid at the inlet end of the inlet channel is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D9/00F28F3/08F28F9/10F28F9/24
CPCF28D9/00F28F3/08F28F9/10F28F9/24
Inventor 陈凯柯汉兵林原胜柯志武黄崇海肖颀魏志国庞杰李邦明李勇吴君刘伟张克龙王俊荣赵振兴苟金澜戴春辉代路
Owner WUHAN SECOND SHIP DESIGN & RES INST
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