Electronic component gluing device

A technology of electronic components and glue covering, which is applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problems of raw material waste, staff contamination with glue, and glue solidification, and achieve the effect of improving work efficiency

Inactive Publication Date: 2021-02-23
西安居正知识产权运营管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the existing glue-coating equipment for electronic components is used, when glue-coating the circuit board, in most cases, the staff needs to fix it manually, which is not only inefficient, but also easily contaminates the glue on the staff. , which brings inconvenience to the staff, and if the lagging stays for too long, it will also lead to unsatisfactory lagging effect and solidification of the glue, resulting in waste of raw materials

Method used

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  • Electronic component gluing device
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Examples

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Embodiment 1

[0024] Example 1, such as Figure 1-3 As shown, the present invention provides a glue coating device for electronic components, including a bottom plate 1, two housings 2 are welded and installed on the top of the bottom plate 1, a slide rail 6 is welded on the top of the bottom plate 1, and the slide rail 6 is located between the two shells 2 Between the inner side of the slide rail 6, the top of the slide rail 6 is slidably fitted with a bracket 7, and the bottom of the bracket 7 is fixed with a pulley 701 by bolts, and the top of the bracket 7 is installed with a shaft 9, and the two ends of the shaft 9 are fixed with tight bolts. Firmware 10.

[0025] Let's talk about the specific settings and functions of the bracket 7, the fastener 10, the heating chamber 5 and the water pump 4 below.

[0026] Such as figure 1 and figure 2 As shown, the top of the bracket 7 is equipped with a shaft 9, the two ends of the shaft 9 are fixed with fasteners 10 by bolts, the top of the br...

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PUM

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Abstract

The invention provides an electronic element gluing device. The device comprises a bottom plate, two shells are welded to the top of the bottom plate, a sliding rail is welded to the top of the bottomplate and located between the inner sides of the two shells, a support is embedded in the top of the sliding rail in a sliding mode, and pulleys are fixed to the bottom of the support through bolts.A shaft rod is installed at the top of the support, and fasteners are fixed to the two ends of the shaft rod through bolts. A heating chamber is installed at the bottom of a liquid storage tank, and when the device works, a heating pipe in the heating chamber operates, so that the heating chamber can directly heat liquid glue in the liquid storage tank, and the situation that the liquid glue is solidified, and consequently raw material waste is caused is avoided.

Description

technical field [0001] The invention relates to the technical field of encapsulation, in particular to an electronic component encapsulation device. Background technique [0002] In the production process of electronic components, encapsulation is one of the essential steps. It can protect the details of important internal parts from external friction and other damage. To a certain extent, it can prolong the life of electronic components. At the same time, after the side glue wrapping of the circuit board is completed, it can not only protect the integrity of the circuit board, but also protect the staff from being cut by the circuit board. [0003] However, when the existing glue-coating equipment for electronic components is used, when glue-coating the circuit board, in most cases, the staff needs to fix it manually, which is not only inefficient, but also easily contaminates the glue on the staff. , It brings inconvenience to the staff, and if the lagging stays for too l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/28H05K2203/0165H05K2203/0746H05K2203/1377
Inventor 齐朝阳
Owner 西安居正知识产权运营管理有限公司
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