An enhanced cooling device for computer

Abstract

The invention relates to the technical field of computers, and discloses an enhanced heat dissipation device for computers, which includes a chassis, an organic body is fixedly installed in the cavity of the chassis, a heat dissipation metal piece is fixedly installed on the top of the chassis, and a water circulation device is arranged on the left side wall of the chassis. The water circulation device includes a first water ring pipe and a water pump. The enhanced heat dissipation device for computer realizes the dynamic circulation of the water body in the first water ring pipe, the second water ring pipe, the third water ring pipe, the first cooling pipe and the second cooling tube cavity by setting a water circulation device Circulation and dynamic circulation of water in the first water ring pipe, the second water ring pipe and the third water ring pipe in the cavity of the chassis to dissipate heat, and the water after cooling is injected into the first cooling pipe and the second cooling pipe through the drain pipe In the cavity, the heat dissipation metal parts are contacted to cool down, so that the heat on the heat dissipation metal parts can be directly taken away, and the efficiency of cooling and heat dissipation of the computer body is improved, thereby achieving the purpose of strengthening heat dissipation.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to an enhanced cooling device for computers. Background technique [0002] In the environment where the computer works for a long time, it needs to carry out heat dissipation and exhaust to remove the heat in the chassis. The water cooling and heat dissipation of the computer in the prior art is generally designed relatively simple, and the following technical defects often exist in the process of use. The first cycle The water device is placed in the chassis, which causes the heat generated by the computer to work for a long time to easily heat the water circulation body, and the water circulation at this time reduces the heat dissipation efficiency of the metal heat sink in the chassis. Second, the design of the water circulation heat dissipation pipe It is relatively simple. It only needs to be bonded with the metal heat sink to take away the heat on the surface of the metal he...

AI Technical Summary

Problems solved by technology

[0002] In the environment where the computer works for a long time, it needs to carry out heat dissipation and exhaust to remove the heat in the chassis. The water cooling and heat dissipation of the computer in the prior art is generally designed relatively simple, and there are often the following technical defects in the process of use. The first cycle The water device is placed in the chassis, which causes the heat generated by the computer to work for a long time to easily heat the water circulation body, and the water circulation at this time reduces the heat dissipation efficiency of the metal heat sink in the chassis. Second, the design of the water circulation heat dissipation pipe It is relatively simple. It is only bonded with the metal heat sink to take away the heat on the surface of the metal heat sink. It cannot achieve super-strong heat dissipation with high efficiency and air jet on the metal heat sink.

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