Server local liquid cooling heat dissipation method and device
A liquid-cooled heat dissipation and server technology, which is applied to instruments, digital data processing components, electrical digital data processing, etc., can solve the problems of single server heat dissipation method, difficult server maintenance, and inability to realize hot-swappable liquid-cooled heat-dissipating components, etc. To achieve the effect of reducing heat dissipation and energy consumption, easy maintenance, and hot swap
Inactive Publication Date: 2021-03-05
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Problems solved by technology
[0005] The technical problem mainly solved by the present invention is to provide a local liquid cooling method and device for a server, which can solve the problem that the server has a single heat dissipation method and cannot realize hot swapping of liquid cooling components during server liquid cooling and heat dissipation, making it difficult to maintain the server
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[0034] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
[0035] Embodiments of the invention include:
[0036] First, see figure 1 , a method for partial liquid cooling of a server, comprising:
[0037] Introduce the coolant connection module, signal connection module and liquid cooling control module inside the server, and introduce the total liquid cooling connection module and the total liquid cooling control module outside the server;
[0038] The total liquid cooling control module is connected to the total liquid cooling connection module, the total liquid cooling connection module is connected to several servers, the liquid cooling control module is connected to the coolant input terminal and s...
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The invention discloses a server local liquid-cooling heat dissipation method and device, and the method comprises the steps of carrying out the heat dissipation of a liquid-cooling heat dissipation device through a heat dissipation part according to the physical characteristics of the liquid-cooling heat dissipation device, the heat dissipation modes of the heat dissipation component comprising aliquid cooling plate heat dissipation mode and a phase-change-free immersion heat dissipation mode; identifying a connection signal of the heat dissipation component and the cooling liquid connectionmodule, wherein the connection signal comprises a connection signal and a closing signal; when a connection signal is recognized, sending a control signal to the heat dissipation component, connecting the heat dissipation component and the cooling liquid connecting module connected with the heat dissipation component according to the control signal, and enabling cooling liquid to circulate in theheat dissipation component through the cooling liquid connecting module and take away heat of the liquid cooling heat dissipation component. According to the invention, multiple heat dissipation modes can be realized in the server, the power consumption of heat dissipation of the server is reduced, the hot plug of the liquid cooling heat dissipation component is realized, and the maintainabilityof the server is improved.
Description
technical field [0001] The invention relates to the field of server heat dissipation, in particular to a method and device for partial liquid cooling of a server. Background technique [0002] With more and more server configurations, different heat dissipation devices are installed inside the server chassis according to different needs. Common heat dissipation devices include air cooling and liquid cooling. Compared with air cooling, liquid cooling is more effective. it is good. [0003] Liquid cooling methods include cold plate heat dissipation and immersion heat dissipation, and immersion heat dissipation includes phase change immersion heat dissipation and non-phase change immersion heat dissipation; cold plate heat dissipation transfers the heat of electronic devices to the liquid cold plate through the liquid cold plate The connected radiator takes heat away through the cooling liquid in the radiator, and the cooling liquid does not directly contact the electronic dev...
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IPC IPC(8): G06F1/20
CPCG06F1/20Y02D10/00
Inventor 闫家乐
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD