Ultrasonic fingerprint module and electronic equipment

Abstract

The invention relates to an ultrasonic fingerprint module and electronic equipment adopting the ultrasonic fingerprint module. The ultrasonic fingerprint module comprises a conductive silver layer. Wherein the conductive silver layer and the flexible circuit board are laminated along a first direction in a binding area of the ultrasonic fingerprint module, and an anisotropic conductive adhesive for conduction is also arranged between the conductive silver layer and the flexible circuit board. Wherein the conductive silver layer has a first thickness d in the first direction, the anisotropic conductive adhesive comprises first conductive particles, and the relationship between the particle size D1 of the first conductive particles and the first thickness d is d < D1 < = (d + 2 [mu] m). On the basis of ensuring that the conductive silver layer and the flexible circuit board are fixed at the same time, the ultrasonic fingerprint module ensures reliable conductivity through the anisotropicconductive adhesive, so that a reliable lap joint conduction effect is achieved between the ultrasonic fingerprint module and the flexible circuit board.

Description

technical field [0001] The present application relates to the field of electronic equipment, in particular to an ultrasonic fingerprint module and electronic equipment using the ultrasonic fingerprint module. Background technique [0002] The ultrasonic fingerprint module is usually connected to the flexible circuit board through anisotropic conductive glue in its bonding area. Anisotropic conductive adhesive has the characteristic of unidirectional electrical conduction, and it behaves as an insulating state in other directions other than this one-way. The overlapping between the ultrasonic fingerprint module and the flexible circuit board in the bonding area is a structure in which multiple pins are paired one by one, so the one-way conduction characteristics of the anisotropic conductive adhesive just match the ultrasonic fingerprint module and the flexible circuit board. on the connection. On the one hand, the anisotropic conductive adhesive can firmly bond the ultraso...

AI Technical Summary

Problems solved by technology

However, the heating temperature is usually between 150°C and 160°C. In the case that some materials in the ultrasonic fingerprint module have low heat resistance, there is a risk of damaging the material

At the same time, when the thickness of the bonding area of ​​the ultrasonic fingerprint module is large, it may cause the conductive particles with relatively small particle sizes to fail to fully rupture after being pressed, thereby affecting the conductive effect of the anisotropic conductive adhesive.

If the particle size of the conductive particles is increased accordingly, it is easy to cause the impedance to be too high, resulting in a bad defect that the conductivity does not meet the needs of use.

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